PCB Assembly Capability

SMT capacity: 19 million points/day
Testing Equipment	X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed	Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications	Pasteable smallest package
	Minimum device accuracy
	IC type chip accuracy
Mounted PCB Specifications	Substrate size
Mounted PCB Specifications	Substrate thickness
throw rate	1. Resistance-capacitance ratio 0.3%
throw rate	2. IC type without throwing material
Board Type	POP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line	50000 points/day
DIP post welding production line	20000 points/day
DIP test production line	50000pcs PCBA/day

Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
project	Mass processing capability	Small batch processing capability
Number of layers (max)	2-18	20-30
Plate type	FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet	PTFE, PPO, PPE
Plate type	Rogers,etc Teflon	E-65, ect
Sheet mixing	4 layers - 6 layers	6th floor - 8th floor
biggest size	610mm X 1100mm	/
Dimensional Accuracy	±0.13mm	±0.10mm
Plate thickness range	0.2mm--6.00mm	0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)	±8%	±5%
Thickness tolerance (t＜0.8mm)	±10%	±8%
Media thickness	0.076mm--6.00mm	0.076mm--0.100mm
Minimum line width	0.10mm	0.075mm
Minimum spacing	0.10mm	0.075mm
Outer copper thickness	8.75um--175um	8.75um--280um
Inner layer copper thickness	17.5um--175um	0.15mm--0.25mm
Drilling hole diameter (mechanical drill)	0.25mm--6.00mm	0.15mm--0.25mm
Hole diameter (mechanical drill)	0.20mm--6.00mm	0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)	0.05mm	/
Hole tolerance (mechanical drill)	0.075mm	0.050mm
Laser Drilling Aperture	0.10mm	0.075mm
Plate thickness aperture ratio	10：1	12：1
Solder mask type	Photosensitive green, yellow, black, purple, blue, ink	/
Minimum Solder Mask Bridge Width	0.10mm	0.075mm
Minimum Solder Mask Isolation Ring	0.05mm	0.025mm
Plug hole diameter	0.25mm--0.60mm	0.60mm-0.80mm
Impedance tolerance	±10%	±5%
Surface treatment type	Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board	Immersion Tin, OSP