PCB Fabrication Capability

Item	Manufacturing Capability
PCB Layers	1~64 Layer
Quality Grade	IPC Class 2｜IPC Class 3
Laminate/Base material	FR-4｜S1141｜High Tg｜PTFE｜Ceramic PCB｜Polyimide｜S1000-2｜IT180A｜Isola-FR408HR｜FR406｜Isola 370 HR｜Rogers｜Taconic｜Arlon｜Halogen Free, etc.
Brand of Laminate	Kingboard｜ITEQ｜Shengyi｜Nanya｜Isola｜TUC｜SYL｜Arlon｜Nelco｜Taconic｜Hitachi｜Rogers, etc.
High Temperature Material	Normal Tg: Shengyi S1141｜KB6160｜Huazhen H140（not suitable for lead-free process ）
	Middle Tg: For HDI、multilayers: SY S1000H｜ITEQIT158｜HuazhengH150｜TU-662｜SY S1150G｜HuazhengH150HF｜H160HF；
	High Tg: For thick copper、high layer: SY S1000-2｜ITEQIT180A｜HuazhengH170｜ISOLA: FR408R｜370HR｜TU-752｜SY S1165
High Frequency Circuit Board Material	Rogers｜Arlon｜Taconic｜SY SCGA-500｜S7136｜HuazhengH5000
High Speed PCB Material	SY S7439｜TU-862HF｜TU-872SLK｜ISOLA: I-Speed, I-Tera@MT40｜Huazheng：H175｜H180｜H380
Ink	Taiyo INK (Japan)｜KUANGSHUN(China)｜RONGDA(China)｜Coates Screen(UK)｜S.M Materials(Taiwan, China)
Heat Conductivity for Alu. Boards	1.0
Chemical	Rohm&Haas (US)｜Atotech (Germany)｜Umicore (Germany)
PCB Type and Services	Prototype PCB｜Rigid PCB｜Flexible PCB(FPC)｜Rigid-Flex PCB｜HDI PCB｜High Tg PCB｜BGA PCB｜Impedance Control PCB｜IMS PCB(LED PCB Board, Aluminum PCB, Metal Core PCB)｜Multilayer PCB｜PCBA(PCB Assembly Service)
Max Board Size	609 * 889 mm
Board Thickness	0.1~8.0mm
Board Thickness Tolerance	±0.1mm / ±10%
Min base copper thickness	Outer layer:1/3oz (12um) ~10oz｜Inner layer:1/2oz~6oz
Max finished copperthickness	6 OZ
Min Mechanical Drilling Hole Size	6mil(0.15mm)
Min Laser Drilling Hole Size	3mil(0.075mm)
Min CNC Drilling Hole Size	0.15mm
Hole Wall Roughness（Max）	1.5mil
Min trace width/spacing(Inner Layer)	2/2mil(Outer layer:1/3oz,Inner layer:1/2oz) （H/H OZ base copper）
Min trace width/spacing(Outer Layer)	2.5/2.5mil （H/H OZ base copper）
Min spacing between hole to inner layer conductor	6mil
Min spacing between hole to outer layer conductor	6mil
Min annular ring for via	3mil
Min annular ring for component hole	5mil
Min BGA diameter	8mil
Min BGA pitch	0.4mm
Min Finished hole size	0.15mm（CNC）｜0.1mm（Laser）
Half Hole Diameter	Minimum Half hole Diameter: 1mm, Half hole is a special technology, so half hole diameter should be greater than 1mm.
Hole Wall Copper Thickness (Thinnest)	≥0.71mil
Hole Wall Copper Thickness (Average)	≥0.8mil
Minimum Air Gap	0.07mm(3mil)
Fine SMD Pitch	0.07mm(3mil)
Max aspect ratios	20:01
Min soldermask bridge width	3mil
Soldermask/circuit processing method	Film｜LDI
Min thickness for insulating layer	2mil
HDI & special type PCB	HDI（1-3 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance …
Max. PTH (Round Hole)	8mm
Max. PTH (Round Slot Holes)	6*10mm
PTH Deviation	±3mil
PTH Deviation (Width)	±4mil
PTH Deviation (Length)	±5mil
NPTH Deviation	±2mil
NPTH Deviation (Width)	±3mil
NPTH Deviation (Length)	±4mil
Hole Position Deviation	±3mil
Character Types	Serial Number｜Barcode｜QR Code
Min Character Width (Legend)	≥0.15mm, Characters width less than 0.15mm will be unidentifiable.
Min Character Height (Legend)	≥0.8mm, Characters height less than 0.8mm will be unidentifiable.
Character Width to Height Ratio (Legend)	1:5, 1:5 is the most suitable ratio for production.
Distance between Trace and Outline	≥0.3mm(12mil), Ship as individual boards: Distance between Trace and Outline ≥0.3mm, Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm
Panelization without Spacing	0mm, Ship as Panelized boards and the spacing between boards is 0mm.
Panelization with Spacing	1.6mm, Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing.
Surface Finishes	OSP｜HASL｜HASL Lead-Free (HASL LF)｜Immersion Silver｜Immersion Tin｜Plated Gold｜Immersion Gold(ENIG)｜ENEPIG｜Golden Finger+HASL｜ENIG+OSP｜ENIG+Golden Finger｜OSP+Golden Finger, etc.
Solder-Mask Finishing	(1). Wet Film (LPI Soldermask)
Solder-Mask Finishing	(2). Peelable Soldermask
Solder Mask Colors	Green｜Red｜White｜Black, Blue｜Yellow｜Orange｜Purple, Gray｜Transparent .etc.
Solder Mask Colors	Matte: Green｜Blue｜Black, etc.
Silkscreen Colors	Black｜White｜Yellow, etc.
Electrical Testing	Fixture / Flying Probe
Other Testing	AOI, X-Ray(AU&NI), Two-dimension Measurement, Hole Copper Instrument, Controlled Impedance Test(Coupon test&Third Party Report), Metalloscope, Peeling Strength Tester, Solderability Test, Logic Contamination Test
Profile	(1). CNC Routing (±0.1mm)
	(2). CNC V-Cut(±0.05mm)
	(3). Bevelling
	(4). Mould-Die Punching(±0.1mm)
Special Capabilities	Thick Copper, Thick Gold(5U”), Gold Finger, Blind and Buried Hole, Countersink Hole, Semi-hole, Peelable Mask, Carbon Ink, Counter sink hole, Plated board edge, Press fit hole, Control depth hole, VIA in PAD, Non-conductive resin plug hole, Plating plug hole, Coil PCB, Super Mini PCB, Peelable Mask, Controlled Impedance PCB, etc.