PCB manufacturing capability

Standard PCB Production Capability
Feature	Capability
Quality Grade	Standard IPC 2
Number of Layers	1 - 32layers
Order Quantity	1pcs - 10,000,000 pcs
Build Time	2days - 5weeks (Expedited Service)
Material	FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size	Min 66mm \| Max 600700mm
Board size tolerance	±0.1mm - ±0.3mm
Board Thickness	0.4mm - 3.2mm
Board Thickness Tolerance	±0.1mm - ±10%
Copper Weight	0.5oz - 6.0oz
Inner Layer Copper Weight	0.5oz - 2.0oz
Copper Thickness Tolerance	+0μm +20μm
Min Tracing/Spacing	3mil/3mil
Solder Mask Sides	As per the file
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Silkscreen Sides	As per the file
Silkscreen Color	White, Blue, Black, Red, Yellow
Surface Finish	HASL - Hot Air Solder Leveling
	Lead Free HASL - RoHS
	ENIG - Electroless Nickle/Immersion Gold - RoHS
	ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS
	Immersion Silver - RoHS
	Immersion Tin - RoHS
	OSP -Organic Solderability Preservatives - RoHS
Min Annular Ring	3mil
Min Drilling Hole Diameter	6mil, 4mil-laser drill
Min Width of Cutout (NPTH)	0.8mm
NPTH Hole Size Tolerance	±.002" (±0.05mm)
Min Width of Slot Hole (PTH)	0.6mm
PTH Hole Size Tolerance	±.003" (±0.08mm) - ±4mil
Surface/Hole Plating Thickness	20μm - 30μm
SM Tolerance (LPI)	.003" (0.075mm)
Aspect Ratio	1.10 (hole size: board thickness)
Test	10V - 250V, flying probe or testing fixture
Impedance tolerance	±5% - ±10%
SMD Pitch	0.2mm(8mil)
BGA Pitch	0.2mm(8mil)
Chamfer of Gold Fingers	20, 30, 45, 60
Other Techniques	Gold fingers
	Blind and Buried Holes
	peelable solder mask
	Edge plating
	Carbon Mask
	Kapton tape
	Countersink/counterbore hole
	Half-cut/Castellated hole
	Press fit hole
	Via tented/covered with resin
	Via plugged/filled with resin
	Via in pad
	Electrical Test