Electronic RF Printed Circuit Board
Name: Electronic RF Printed Circuit Board
Type: home appliance pcba
Brand name: JRK, pcba/fpcb
Copper Thickness: 1 oz
Surface treatment: HASL lead free
Minimum aperture: 0.25mm
Minimum line spacing: 0.003"
Material: FR-4
Layers: 2 layers
Name: Rogers 4003 RF Circuit Board
Model: High Frequency PCB-001
Type: Multilayer circuit board
Brand Name: ODM and OEM
Layers: 6 layers
Substrate: Rogers
Copper Thickness: 0.5oz-5oz
Plate thickness: 0.1 - 4mm
Surface treatment: HASL, ENIG, Immersion Silver, Immersion Tin, OSP
Board size: customized
Solder mask: yellow etc.
Silkscreen: white
Name: RF boost circuit board
Substrate: FR-4/Aluminum/Ceramic/cem-3
Copper Thickness: 0.5oz-8oz
Plate thickness: 0.2mm - 7mm
minute. Hole size: 0.02mm
minute. Line width: 0.003"
minute. Line Spacing: 0.003"
Surface treatment: HASL lead free
Product Name: Printed Circuit Board
Certificate: RoSH ISO/TS16949
Application: Electronic Equipment
Solder mask color: white black yellow green red
Material: FR4 CEM1 CEM3 High TG
Testing services: ICT, AOI, X-ray, functional testing
Silk screen color: black.white.yellow
Name: Rogers RO3003 RF PCB
Type: consumer electronics pcba
Copper Thickness: 1 oz, 1 oz
Applications: Electronics/Communications, Computers, Medical, Automotive
Service: PCB/PCBA/SMT/Component Sourcing
Solder mask color: blue, green, red, black, white, etc.
Testing Services: AOI X-ray Functional Testing
Certificate: ROHS/ISO9001
Substrate: FR-4/Hi-Tg/HDI/High Frequency Board/Copper Substrate
Plate thickness: 1.6mm
RF RC Helicopter Controller PCB
Name: RF RC Helicopter Controller PCB
Model: HX-007-729
Test Service: Flying Probe Test
Type: electronic board
Packing: anti-static bubble bag
Solder Mask Color: Green, White, Black
Layers: 1-58 layers
Certificate: ISO9001/RoHS/CE
Service: OEM
Usage: home appliance accessories
Name: RF Half Hole PCB
Substrate: FR4, High TG FR4, High Frequency, Alum, FPC
Copper Thickness: 0.5-4 0z
Plate thickness: 0.1-4mm±10%
minute. Hole Size: 0.0078" (0.2mm)
minute. Line width: 0.003 in (0.075 mm)
minute. Line Spacing: 0.003" (0.075mm)
Surface treatment: HASL, ENIG, Immersion Silver, Immersion Tin, OSP
Board size: square, round, irregular (with fixture)
Services: PCB and PCB Assembly
Layers: 1-48
PTH hole tolerance: ±0.002 in (0.005 mm)
Minimum Soldermask Gap: 0.003" (0.07mm)
Screen printing minimum size: 0.006"0.15mm)
Maximum size of decorative panel: 700*460mm
PCB shape: square, round, irregular (with fixture)
Subcomponents: plastic, metal, screen
Certificate: IATF16949, ISO13485, ISO9001, ISO14001
Name: HDI PCB RF Circuit Board
Layers: 2 layers
Substrate: FR-4
Copper Thickness: 1 oz
Plate Thickness: 1.6mm, 1.6mm
Hole size: 0.1mm
Line width: 3 mm
Line spacing: 3 mm
Surface treatment: spray tin lead-free, spray tin lead-free
Minimum aperture: 0.25mm
Minimum line spacing: 0.003"
Color: Green or as your request
Name: Rogers 4003 RF PCB
Substrate: Rogers 4003
Copper Thickness: 1.0mm
Plate Thickness: 1.6mm
minute. Hole size: 0.1mm
minute. Line width: 0.1mm
minute. Line spacing: 0.1 mm
Item: High Frequency PCB Rogers 4003 RF PCB for RF
Maximum processing area: 680×1000MM
Layers: 1-28 layers
Silk screen color: black, white, red, green
Finished board: thickness≤1.0MM, tolerance: ±0.1MM
Twist and Bend: ≤ 0.75%, Min: 0.5%
TG range: 130 - 215℃
Certificate: ISO9001.ROSH.UL
- PCB manufacturing equipment
- PCB manufacturing capability
Standard PCB Production Capability | |
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 1 - 32layers |
Order Quantity | 1pcs - 10,000,000 pcs |
Build Time | 2days - 5weeks (Expedited Service) |
Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Board Size | Min 6*6mm | Max 600*700mm |
Board size tolerance | ±0.1mm - ±0.3mm |
Board Thickness | 0.4mm - 3.2mm |
Board Thickness Tolerance | ±0.1mm - ±10% |
Copper Weight | 0.5oz - 6.0oz |
Inner Layer Copper Weight | 0.5oz - 2.0oz |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS | |
ENIG - Electroless Nickle/Immersion Gold - RoHS | |
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS | |
Immersion Silver - RoHS | |
Immersion Tin - RoHS | |
OSP -Organic Solderability Preservatives - RoHS | |
Min Annular Ring | 3mil |
Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
Min Width of Cutout (NPTH) | 0.8mm |
NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±4mil |
Surface/Hole Plating Thickness | 20μm - 30μm |
SM Tolerance (LPI) | .003" (0.075mm) |
Aspect Ratio | 1.10 (hole size: board thickness) |
Test | 10V - 250V, flying probe or testing fixture |
Impedance tolerance | ±5% - ±10% |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.2mm(8mil) |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Other Techniques | Gold fingers |
Blind and Buried Holes | |
peelable solder mask | |
Edge plating | |
Carbon Mask | |
Kapton tape | |
Countersink/counterbore hole | |
Half-cut/Castellated hole | |
Press fit hole | |
Via tented/covered with resin | |
Via plugged/filled with resin | |
Via in pad | |
Electrical Test |