Rigid-Flex PCB Assembly manufacturers
Name: Flexible circuit board assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Name: FPC PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Camera Module Rigid-Flex PCB Assembly
Name: FPC OV2640 Camera Module PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Medical Device Rigid-Flex PCB Assembly
Name: Medical Device Rigid-Flex PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Name: 4-layer flexible PCBs
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Medical Machinery PCBA Processing
Name: Medical Machinery PCBA Processing
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003'', NPTH +/-0.002
Hole Position Accuracy: +/-0.003"
Ring: Min. 0.1mm
Aspect Ratio: Minimum 1:8
Application areas: communication equipment, automotive electronic computers, medical equipment and consumer electronics
Wireless Charging Module Rigid-Flex PCB Assembly
Name: Wireless Charging Module Rigid-Flex PCB Assembly
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003'', NPTH +/-0.002
Hole Position Accuracy: +/-0.003"
Ring: Min. 0.1mm
Aspect Ratio: Minimum 1:8
Application areas: communication equipment, automotive electronic computers, medical equipment and consumer electronics
Orthopedic surgical instrument smt patch
Name: Orthopedic surgical instrument smt patch
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003'', NPTH +/-0.002
Hole Position Accuracy: +/-0.003"
Ring: Min. 0.1mm
Aspect Ratio: Minimum 1:8
Application areas: communication equipment, automotive electronic computers, medical equipment and consumer electronics
6-layer rigid-flex PCB assembly
Name: 6-layer rigid-flex PCB assembly
Structure: 2L flexible + 4L rigid
Hole size: 8mil
Surface Treatment: Immersion Gold
Material: FR-4+PI
Number of layers (R+F): 2R+2F+2R layers
Thickness: 0.24mm+1.2mm
Minimum hole: 0.15 mm
Minimum Line/Space: 4/4mil
Impedance: No
Surface Treatment: Gold Plated
Multilayer Rigid-Flex PCB Assembly
Name:Multilayer Rigid-Flex PCB Assembly
Category:FPC
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Tolerance: ± 0.03mm
Thickness: 0.15mm
Stiffener: positive and negative 0.15mm steel stiffener
Production process: solder coating, plug plating, cover, film type, solder mask type shielded scratch
Surface treatment: Chen Jin (gold) 1 to 2 micro inches
Minimum line width / line distance: 0.06mm / 0.09mm
Other: urgent model after 24-48 hours / normally after 1-3 days shipping
- PCB Assembly Equipment
- PCB Assembly Capability
Automatic solder paste printing machine
AOI Optical Inspection
SMT high-speed placement machine
Nitrogen reflow soldering
x-ray
Three anti-paint spraying machine
SPI Solder Paste Thickness Tester
Automatic wave soldering machine
first article inspection
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um--175um | 8.75um--280um |
| Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
| Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.
Kingford cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.
It has 10 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.
We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.
According to your needs, we can purchase all kinds of components you need at the most affordable price and minimize your labor costs.
High-standard confidentiality measures, signing confidentiality agreements, and all documents exporting must be approved to ensure that 100% of documents are not leaked.
we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.
Kingford provides one-stop services such as PCB design, DFM services, PCB manufacturing, PCB assembly, and component procurement.
We provide Flexible circuit board assembly,flexible PCB design,circuit board assembly services. King...
We provide FPC PCB Assembly Flexible printed circuit Assembly services. Kingford is your one-stop ri...
We provide Camera Module Rigid-Flex PCB Assembly Rigid-Flex PCB Assembly services. Kingford is your ...
We provide Medical Device Rigid-Flex PCB Assembly Rigid-Flex PCB Assembly services. Kingford is your...
Kingford is a one-stop solution provider for professional 4-layer flexible PCBs, flexible PCB assemb...
Kingford's flexible circuit board assembly has a highly complex configuration and can withstand hars...
The advantages of rigid-flex bonding are: 360-degree bendability; lightweight; reduced space requirements through 3D capabilities; shock resistance; fewer solder joints for higher connection reliability; simplified PCB assembly process.
Laminating a flexible circuit substrate and a rigid circuit substrate together is a rigid-flex PCB.
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