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10-layer Rigid immersion gold PCB
Name: 10-layer immersion gold PCB
Layers: 10 layers
Material: FR4 High TG
Finished plate thickness: 1.6mm
Finished copper thickness: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1/1/1/1/1/1/1/1/1 oz
Special Process:
Minimum line width 3.5mil
Hole wall thickness 25um
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Small BGA Rigid Printed Circuit Boards
Name: Small BGA circuit board PCB
Layers: 4 layers
PCB Material: FR4 TG170
PCB thickness: 1.6mm
Surface treatment: Immersion Gold ENIG(Gold thickness 2u”)
Finished Copper Thickness: 1/1/1/1 OZ
Solder Mask Ink: Green, Sun PSR-4000
Special Process:
Minimum line width and line spacing: 0.07/0.09mm
BGA pad: 0.25 mm
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Rigid immersion gold PCB board
Name: Immersion Gold Plate
Layers: 4 layers
Material: FR4
Finished plate thickness: 1.6mm
Surface treatment: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1/1/1 oz inside and outside
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Name: Small BGA circuit board
Material: FR4 High TG
Finished plate thickness: 1.6mm
Surface treatment: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1 oz inside and outside
Special Process:
BGA pad 0.1mm
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Green oil Rigid Printed Circuit Boards
Name: Green Oil PCB
Layers: 2 layers
Material: FR4 TG150
Finished plate thickness: 1.6mm
Surface treatment: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1 oz inside and outside
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6-layer blue oil immersion gold PCB board
Name: 6-layer blue oil immersion gold plate
Layers: 6 layers
Material: FR4 TG170
Finished plate thickness: 1.6mm
Surface treatment: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1/1/1/1/1 oz inside and outside
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6 layers Rigid Printed Circuit Boards
Name: 6-layer black immersion gold PCB
Layers: 6 layers
Material: FR4 TG170
Finished plate thickness: 1.6mm
Finished copper thickness: Immersion Gold (ENIG)
Finished copper thickness: inner and outer layers 1/1/1/1/1/1 OZ
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Name: 2 Layers FR4 PCB
Layers: 2 layers
Material: FR4
Finished plate thickness: 1.6mm
Finished copper thickness: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1 oz inside and outside
- PCB Manufacturing Equipment
- PCB manufacturing capability
PCB Drilling machine
PCB pattern plating line
PCB solder mask expose machine
PCB pattern expose machine
Strip film etching line
Solder mask screen silk print machine
Solder mask scrubbing line
PCB Flying Probe Test (FPT)
Fully automatic exposure machine
Standard PCB Production Capability | |
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 1 - 32layers |
Order Quantity | 1pcs - 10,000,000 pcs |
Build Time | 2days - 5weeks (Expedited Service) |
Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Board Size | Min 6*6mm | Max 600*700mm |
Board size tolerance | ±0.1mm - ±0.3mm |
Board Thickness | 0.4mm - 3.2mm |
Board Thickness Tolerance | ±0.1mm - ±10% |
Copper Weight | 0.5oz - 6.0oz |
Inner Layer Copper Weight | 0.5oz - 2.0oz |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS | |
ENIG - Electroless Nickle/Immersion Gold - RoHS | |
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS | |
Immersion Silver - RoHS | |
Immersion Tin - RoHS | |
OSP -Organic Solderability Preservatives - RoHS | |
Min Annular Ring | 3mil |
Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
Min Width of Cutout (NPTH) | 0.8mm |
NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±4mil |
Surface/Hole Plating Thickness | 20μm - 30μm |
SM Tolerance (LPI) | .003" (0.075mm) |
Aspect Ratio | 1.10 (hole size: board thickness) |
Test | 10V - 250V, flying probe or testing fixture |
Impedance tolerance | ±5% - ±10% |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.2mm(8mil) |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Other Techniques | Gold fingers |
Blind and Buried Holes | |
peelable solder mask | |
Edge plating | |
Carbon Mask | |
Kapton tape | |
Countersink/counterbore hole | |
Half-cut/Castellated hole | |
Press fit hole | |
Via tented/covered with resin | |
Via plugged/filled with resin | |
Via in pad | |
Electrical Test |