Bluetooth module smt patch processing
Name: Bluetooth module smt patch processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products
Bluetooth module refers to the basic circuit group of the chip integrated with Bluetooth function, which is used for short-distance 2.4G wireless communication module
Bluetooth technology manages the communication channel of the wireless part. The Bluetooth module can wirelessly transmit and receive data using two devices. The Bluetooth module can receive and transmit data from the host system with the help of the Host Controller Interface (HCI)
Bluetooth is actually a wireless technology standard. It uses the 2.4G frequency band and is used for data transmission between short-distance Bluetooth devices. Based on the characteristics of low power consumption, stable data connection and high security of Bluetooth, it occupies a major position in various application markets. core position. Bluetooth modules are generally composed of PCB boards, chips, and peripheral components, and are used to replace data lines for short-distance wireless communication in a small range. Module A module refers to a collection that can complete a certain function, and has an interface to connect to the external environment and an internal code program. The packaging of the module can be divided into pins and patches. The pin test and use are relatively convenient, and the patch is more suitable for mass production. Bluetooth module Bluetooth module refers to a collection of integrated Bluetooth chips, code programs, and basic circuits, capable of mesh networking and data transmission. It is mainly used to complete the data exchange between devices. According to the application and support agreement, it is divided into classic bluetooth (BT) and low-power bluetooth (BLE): classic bluetooth: generally refers to the module that supports bluetooth 4.0 or less, and is generally used for the transmission of large data, such as voice, music and other high data volume transfer. Bluetooth Low Energy BLE: refers to a module that supports Bluetooth 4.0 or higher, Bluetooth with low power consumption and small data transmission
Bluetooth modules assembled with SMT patches are smaller in size and better in performance
Name: Bluetooth module smt patch processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products
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