RoHS Custom Quick Turn PCB Manufacturing and PCB Assembly
Name: RoHS Custom Quick Turn PCB Assembly(SMT chip processing)
PCBType: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
PCB Layers: 1~30 Layer
Board Thickness: 0.1~8.0mmBoard Thickness
Tolerance: ±0.1mm / ±10%
Surface Finishes: OSP, HASL, HASL Lf, Immersion Gold, Etc.
Solder Mask Colors: Green, Red, White, Black, Blue, Yellow, Orange
Silkscreen Colors: Black, White, Yellow, Etc.
Electrical Testing: Fixture / Flying ProbeOther
Testing: Aoi, X-ray(Au&Ni), Controlled Impedance Test
OSP Finish 94v0 PCB Board RoHS Medical PCB Assembly
Name:OSP Finish 94v0 PCB Board RoHS Medical PCB Assembly
PCBA-Testing:X-ray, Aoi
Small Order:Acceptable
Type:Rigid Circuit Board
Flame Retardant:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Organic Resin
Material:Complex
Transport Package:Antistatic Package+Plastic Box and Carton Box
Origin:Shenzhen China
Production Capacity:100K/Month
OEM Electronic Medical Equipment PCB Customized
Name:OEM Electronic Medical Equipment PCB Customized
PCBA-Testing:X-ray, Aoi
Small Order:Acceptable
Type:Rigid Circuit Board
Flame Retardant:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Organic Resin
Material:Complex
Transport Package:Antistatic Package+Plastic Box and Carton Box
Trademark:Customized
Origin:Shenzhen China
Production Capacity:100K/Month
Medical Audio Motherboard Assembly Circuit PCB Board Multilayer PCB Assembly
Name:Medical Audio Motherboard Assembly Circuit PCB Board Multilayer PCB Assembly
Product Type:PCB Assembly
Min.Hole Size:0.12mm
Solder Mask Colour:Green, Blue, White, Black, Yellow, Red etc
Surface Finish:HASL, Enig, OSP, Gold Finger
Min Trace Width/Space:0.075/0.075mm
Copper Thickness:1 - 12 Oz
Assembly Modes:SMT, DIP, Through Hole
Application Field:LED, Medical, Industrial, Control Board
Samples Run:Available
Transport Package:Vacuum Packing/Blister/Plastic /Cartoon
Specification:Customized
Trademark:OEM / ODM
Origin:China
Production Capacity:50000pieces Per Month
- PCB Assembly Equipment
- PCB Assembly Capability
- PCB Assembly Capability
Item | Process Capability Parameter |
Order Quantity | ≥1PC |
Quality Grade | IPC-A-610 |
Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
Size | 50*50mm~510*460mm |
Board Type | Rigid PCB, Flexible PCB, metal core PCB |
Min Package | 01005 (0.4mm*0.2mm) |
Max Package | No limit |
Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
Component Sourcing | Turnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned |
BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
SMT Parts Presentation | Cut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel |
Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
Stencil | Stencil with or without frame (offered free by PCBMay) |
Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
SMT Capacity | 3 Million~4 Million Soldering Pad/day |
DIP Capacity | 100 Thousand Pins/day |
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |