Features of SMT
1. The assembly density is high, the electronic products are small in size and light in weight, the volume and weight of the chip components are only about 1/10 of the traditional plug-in components. Generally, after using SMT, the electronic products are reduced by 40% ~ 60% in volume and 60% in weight 80%.
2.High reliability and strong anti-vibration ability. Low solder joint defect rate.
3.Good high frequency characteristics. Reduced electromagnetic and radio frequency interference.
3.Easy to implement automation and improve production efficiency. Reduce costs by 30% to 50%. Save material, energy, equipment, manpower, time, etc.
Why use Surface Mount Technology (SMT)?
1.The miniaturization of electronic products is pursued, and the previously used through-hole components cannot be reduced.
2.Electronic products have more complete functions, and the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ICs, which have to use surface-mount components.
3.Product batching and production automation. The factory should produce high-quality products at low cost and high output to meet customer demand and strengthen market competitiveness.
4.Development of electronic components, development of integrated circuits (ICs), multiple applications of semiconductor materials.The electronic technology revolution is imperative, chasing the country.