OSP Antioxidant PCB Circuit Board

Composition of OSP: The general ingredients are: alkyl benzimidazole, organic acid, copper chloride and deionized water.

Advantages of OSP

1. Thermal stability, when compared with FLUXK, which is also a surface treatment agent, it is found that after the secondary heating of OSP at 235 ° C, the surface has no entanglement phenomenon, and the protective film is not damaged. Take two samples of OSFP and ELUX respectively, and put them into 6NC, 10% constant temperature surface submersible at the same time. After one week, the sample of OSP has no obvious change, while the surface of the sample of FULX has small dots, that is, it is blocked. Oxidized after heating.

⒉Simple management, the process of OSP is relatively simple and easy to operate. The client can use any kind of welding method to process it without special treatment; in circuit production, there is no need to consider the problem of surface uniformity. There is no need to worry about the concentration of its liquid medicine, simple and convenient management method, and fool-proof operation method.

3. Low cost, because it only reacts with the bare copper part to form a non-sticky, thin and uniform protective film, so the cost per square meter is lower than other surface treatment agents. cheap

4. To reduce pollution, OSP does not contain harmful substances that directly affect the environment, such as: lead and lead compounds, bromine and bromine compounds, etc. In the automatic production line, the working environment is good, and the equipment requirements are not high

5. Downstream manufacturers are easy to assemble, using OSP for surface treatment, the surface is flat, when printing tin or pasting SMD components, the offset of the parts is reduced, and the probability of empty welding of SMD solder joints is reduced.

OSP circuit boards can reduce poor solderability. During the production process, inspectors are required to wear gloves to prevent hand sweat or water droplets from remaining on the solder joints, causing their components to decompose.

In the environment where customers around the world use lead-free explosive connections, the general surface treatment is very suitable. As the OSP process does not contain harmful substances, the surface is smooth, the performance is stable, and the price is low. Using a simple surface treatment process will be the best in the circuit board industry. A trend of surface treatment, high-density BGA and CSP have also begun to be introduced and used.