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14-layer 25G high-speed HDI PCB design

14-layer 25G high-speed HDI PCB design

(1) High insulation reliability and micro-via reliability;(2) High glass transition temperature (Tg);(3) Low dielectric constant and low water absorption;(4) High adhesion and strength to copper foil;(5) The thickness of the insulating layer after curing

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.