With the progress of technology in the 1990s, chip integration continued to improve, the number of I/O pins increased sharply, power consumption also increased, and the requirements for integrated circuit packaging were more stringent. In order to meet th
BGA package introduction BGA package (Ball Grid Array Package), that is, ball grid array, is a surface mount package chip used for an integrated circuit. Xiaoliu, I was a little confused at the beginning, what the hell is a ball grid array? In fact
The circuit board manufacturer and circuit board designer will explain the component packaging knowledge to you
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