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BGA welding

What is BGA welding

As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.

BGA welding joint mixed process type fracture

A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.

Let's take a look at BGA welding process in PCB industry

Understand PCB design, PCB layout and PCB manufacturing in PCB related industries and Let's take a look at BGA welding process in PCB industry

Which flux paste should be used for BGA welding, and the white and yellow ones are better

The PCB manufacturer, PCB designer and PCBA manufacturer will explain to you which soldering paste should be used for BGA welding, and which is better, white or yellow

Increase the amount of solder paste to improve BGA welding defects?

PCB manufacturers and PCB designers explain that increasing solder paste can improve BGA welding defects

What are the defects of BGA welding

What are the common BGA welding defects? How to handle

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.