For a long time in the industry, the Tg value has been the most common index used to classify FR-4 substrates. It is generally believed that the higher the Tg value, the higher the reliability of the material.For example, in the picture below, the descrip
The reserved process edge is the part added on both sides or four sides of PCB board to assist the patch plug-in to weld the missing board, which is mainly to assist production and does not belong to the PCB board. It can be removed after the PCBA manufac
The exchange of PCB design/manufacturing data is the key to the information integration of electronic design and manufacturing. Therefore, it is urgent to establish a new format standard of PCB data exchange.
OSP membranes have been used in circuit boards for many years as organomaterials formed by the reaction of azole compounds (azole) with transition metal elements, such as copper and zinc.
Electromagnetic compatibility in the design of printed circuit board (PCB) involves many factors, the following mainly from three parts to be elaborated, the specific selection to integrate various factors.
Core plate fabrication → inspection → surface treatment → superimposed semi-curable sheet and RCC→ pressing → positioning of the pattern of the hole → etching the window of the hole →CO2 laser drilling → removal of protective film → metallization of the h
There are three main types of core boards for laminates, namely, the core boards are manufactured by hole metallization or electroplating technology, the core boards are manufactured by conductive glue technology and the core boards are manufactured by in
The semi-molten solder paste is placed on the circuit board by the steel mold, and then the SMD components are pasted on it, and it is welded on the circuit board by reflow welding
Therefore, copper can be used as the base of electrodeposition of many metals, and copper plating plays an important role in the production process of printed board.
For high - level circuit board processing technology research literature, the industry is relatively few. This paper introduces material selection, laminated structure design, interlayer alignment, inner line production, pressing process, drilling process
High TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials are used in high-rise board, which puts forward high requirements for inner line fabrication and graphic size control.
In addition to the problems caused by the improper operation of wave soldering operators, the design defects of wave welding equipment itself and maintenance should also be paid attention to.
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