SMT patch processing requirements for flux
In the welding process of SMT patch processing, the substance that can purify the welding metal and welding surface and help welding is called flux, referred to as flux.
In the welding process of SMT patch processing, the substance that can purify the welding metal and welding surface and help welding is called flux, referred to as flux.
The company gives full play to its competitive advantages in scale procurement and quality control, and has signed long-term cooperation agreements with many electronic component manufacturers at home and abroad and around the world to ensure the quality
Shenzhen circuit board assembly and processing manufacturers, providing one-stop services from upstream electronic component procurement to PCB production and processing, SMT patch, DIP plug-in, PCBA testing, finished product assembly and so on.
PCB DIP plug-in processing is a very important process in PCBA chip processing, and its processing quality directly affects the functional properties of , so it is necessary to pay more attention to the DIP plug-in process.
In PCBA processing, automatic optical inspection is usually set at the last step of the SMT production line, and it is necessary to detect the defects of the product after the completion of the SMT processing process.
R107, C118, Q102, D202 and other numbers are often seen on the PCB board. In general, the first letter identifies the device category, such as R for resistor, C for capacitor, D for diode, Q for transistor, etc.
Poorly welded electronic components. In the face of this situation, we generally remove poorly welded electronic components without damaging the PCB board.
In the process of selecting materials for electronic components, not following the recommended guidelines may lead to heat dissipation problems. When selecting an electronic component, it is important to look at the detailed data and consider all relevant
Pcb circuit board proofing: pcb circuit board proofing refers to the production of a small part of the product as a sample before the start of mass production, so that it can be better completed, and the perfect combination of mass production circuit boar
Defects in the PCB board design process will bring huge hidden dangers to the finished product.
Designers using this approach can focus on masking the microstrip length of the copper foil in order to obtain good performance for signal integrity. For systems that use dense connectors in the communication structure, the designer can use a PCB as the t
PCB board is composed of copper foil, resin, glass cloth and other materials. Each material has different physical and chemical properties. there will inevitably be residual thermal stress, which leads to deformation.