That is: the actual out of the board is the circuit diagram to the right edge line as the reference line to the right after 180 degrees of the page. Pay special attention when there is a blank space! Otherwise the board is useless!
In China, the demand for backplanes mainly comes from the communications industry, which is now growing in the field of communications equipment manufacturing.
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity. But other factors can not be ignored, only
Big data and artificial intelligence are making humans more dependent on electronic systems, and will make reliability deficiencies even more deadly. At DesignCon 2020 recently, I had the opportunity to learn how ANSYS enables engineers to design highly r
In the ground plane segmentation and signal routing, the distribution of ground plane and important signal routing should be taken into account to prevent the problems caused by the ground plane slotting.
Based on years of actual production experience and service experience, Now on the circuit board of copper plating surface foaming causes do a brief analysis, hope to help the industry peers!
A blind by-pass hole and a microvia hole are created in the pad to allow direct wiring to another layer. Because these bypass holes are small and blind, they do not suck up much solder, resulting in little or no effect on the amount of tin in the solder j
The removal of copper from the through-hole can be caused by chemical factors, such as etching, or mechanical causes, such as blow-holing, stress cracking, or deposition detachment.
In a high speed PCB, wiring is more than just connecting two points. As a qualified engineer, wiring is a hybrid knowledge carrier including resistance, capacitance and inductance.
To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent thermal conductivity (9EQ) of the insulating substrate for PCB, which is composed of various materials with different thermal conductivity.
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride.
Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.
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