First, clean the cured photosensitive film on the PCB. It is then cleaned of excess copper foil covered with a strong alkali. The tin coating on PCB layout copper foil is then removed with destin solution. After cleaning, complete the 4-layer PCB layout.
Note for circuit board welding: 1, after getting the PCB bare board, first check the appearance; 2, after the materials required for circuit board welding are complete; 3, when selecting components for welding, welding should be carried out in the order o
Polygon filling deviation usually occurs when polygon plating copper on multi-grid circuit boards. While it does not have a standard based on a single grid, it can provide service beyond the required life of the boards.
Circuit board design required data: 1. Circuit diagram, necessary, 2. Circuit consumption power calculation, not necessary, 3. Circuit diagram Electrical list, not required, 4. Component table, required, 5. Circuit board design drawing, required, 6. Circu
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Materials for PCBA electronic products patch processing: 1. Complete PCB board making file and board making requirements; 2. 2. Complete BOM, 3. PCBA assembly drawing, PS: report the cost of PCBA function test, and provide the method of PCBA function test
The warping of PCB circuit boards has great influence on the production of printed PCB circuit boards, and warping is one of the important problems in the production process of PCB circuit boards. Bent, component foot is difficult to clean.
PC8 production is not difficult, the difficulty lies in the production of fault troubleshooting. Whether it is an individual hobbyist or an industry engineer, it is quite troublesome to encounter problems when debugging PCB circuit boards.
In fact, printed PCB circuit boards used in electronic equipment are different, and printed PCB circuit boards are classified differently according to different specifications.
One of the causes of PCB warping is that the substrate used may warpage, but in the process of PCB processing, due to thermal stress, chemical factors, and improper production process will also cause PCB warpage.
Width and spacing of printed wire are important design parameters, which affect not only the electrical performance and electromagnetic compatibility of PCB board, but also the manufacturability and reliability of PCB board.
The performance index of high frequency circuit directly affects the quality of the whole product. The layout and wiring of components can maximize the performance index of the circuit and achieve the design purpose of anti-interference.
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