PCB copy board process some small principles :1, printed wire width selection basis: 2, line spacing: 3, pad: 4, draw circuit frame: 5, component layout principle: 6, input signal processing unit, 7, component placement direction: 8, component spacing. 9.
Why is lead not allowed on printed boards, assembly processes and products? There are two reasons for this: first, lead is toxic and affects the environment; Second, leaded solder is not suitable for new assembly technology.
During the installation of the reinforced frame and the PCBA, and the installation of the PCBA and the chassis, directly or forcibly install the warped PCBA or the warped reinforced frame and install the PCBA in the deformed chassis.
In order to meet customer requirements, the circuit board must plug holes through the hole, after a lot of practice, change the traditional aluminum sheet plug process, with white mesh to complete the circuit board surface welding and plug holes.
General circuit board production will be carried out board work, its purpose is to increase the production efficiency of SMT production line.
Image of local separation caused by local expansion between layers of substrate or between substrate and conductive foil or between substrate and protective coating.
in fact, no matter how to produce or design, ultimately can not be separated from the consideration of money, so should all the factors into the amount to make the final measurement standard to choose a suitable plate method.
Scan the circuit board, record the location of the components in detail, disassemble the components to make a bill of materials and arrange material purchase, and scan the empty board into pictures to process and restore the PCB board drawing file.
With sufficient theoretical basis, more practice, more learning, more summary, in order to be qualified for the PCBA circuit board maintenance post.
After the design of PCB board, the need to choose the circuit board surface treatment process, the circuit board surface treatment process is now commonly used HASL (surface spray tin process), ENIG (gold process), OSP (oxidation prevention process).
PCB performance test is a necessary test to ensure the stability of product performance after processing. It is divided into different tests according to the actual environment and purpose of product use.
First, scan the circuit board of the copying board, record the location of the components in detail, remove the components to make the BOM, scan the empty board into pictures, process and restore the PCB board drawing file.
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