In electronic assembly, printed circuit board is a key component. It is equipped with other electronic parts and connected to the circuit to provide a stable circuit working environment.
With increasing frequency, it becomes more and more difficult to control the phase consistency of printed circuit board materials. Accurately predicting the phase change of circuit board materials is not a simple or routine task.
in the manufacturing process of PCB, the three stages that must be tested are the inner layer after etching, the outer line after etching, and the finished product.
This is done by making multiple design changes to a small number of boards and then testing all variants before the next manufacturing run. These variants are for assembly only, and all bare plates are manufactured in a similar manner.
PCB industry is technology-intensive and capital-intensive, but it is still labor-intensive. A large number of automation equipment needs manual operation and assembly line operation. A medium-sized PCB enterprise has thousands of employees.
Chemicals should be stored in designated areas, away from the work area, and at a specified safe distance, and must be equipped with safety facilities.
bottom solder layer top solder layer drill guide, multilayer mechanical layer is to define the appearance of the entire PCB board, in fact, when we say the mechanical layer is referring to the overall structure of the PCB board.
Some circuit board shape is special, different shape, through the board can be more effective use of PCB substrate area, reduce waste, save costs.
PCB circuit board copper wire stripping is not good, PCB factories are said to be laminate problems, requiring its production factories to withstand losses.
PCB board path through single-sided, double-sided, multi-layer progress and improvement, and the proportion of PCB multi-layer board increased year by year.
The manufacturing process of printed board is still more complex, to go through the light painting, photographic plate and other chemical processes, consume more materials, longer cycle, high cost.
In the manufacturing process of HDI circuit board, there are many defects and difficulties in the process, among which the most important problems are the blind hole sag can not be routed, can not be transferred to form the circuit and so on.
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