For those devices that are easy to produce noise, small current circuits, large current circuit switching circuits, etc., should try to keep it away from the logic control circuit and storage circuit (ROM, RAM) of the single chip computer, if possible, th
What is the circuit and load impedance? Whether there is space to place magnetic beads on the PCB board. The first three can be judged by observing the impedance frequency curve provided by the manufacturer.
Each PCB board is basically composed of the aperture hole layer, DRILL layer, line layer, solder mask layer, character layer, in the CAM350, each load layer will be separated by a different color, so that we can operate.
In the environmental protection and clean zone, a number of innovative technologies and solutions applied to the "three wastes" (waste gas, wastewater, solid waste) treatment and resource recovery in the printed circuit board industry were also ...
PCB production process is more complex, it involves a wide range of processes, from simple machining to complex machining, there are ordinary chemical reactions and photochemical electrochemical thermochemistry and other processes, computer-aided design C
From passive components to active components and integrated circuits, all eventually become surface mount devices (SMDS) and can be assembled by pick-up and drop devices. For a long time it was thought that all pin components could eventually be packaged
The production process and chemical solution of different PCB design manufacturers are still very different. Before the design of the wastewater treatment project, participate in the waste water diversion work of PCB board design and production, and verif
Whether the edge of the outer frame of the power supply layer in the multi-layer board is reduced, such as the copper foil of the power supply layer is exposed outside the board, which is easy to cause short circuit.
For amplifiers with push-pull circuit and bridge circuit, attention should be paid to the symmetry of electrical parameters of components and the symmetry of structure when arranging, so that the distribution parameters of symmetrical components are as co
PCB assembly, do not apply any solder on the top or bottom pad. Use screws with built-in washers to achieve tight contact between the PCB and the metal case/shield or ground surface bracket.
the idea that thin films can be used to give mechanical strength or adequate insulation to individual parts inserted into printed circuit boards is wrong. The components must be mechanically inserted and must have their own suitable caulking agent, so tha
the oscillating circuit components as close as possible to the IC, the oscillating circuit as far as possible away from the antenna and other vulnerable areas. Put a ground pad under the crystal oscillator.
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