High-speed signal networks, such as clock signals, produce closed-loop results when multi-layer PCB lines are routed. Such closed-loop results will generate ring antennas and increase EMI radiation intensity.
It has been proved that the reliability of electronic equipment will be adversely affected even if the circuit diagram is designed correctly and the printed circuit board is not designed properly.
These are the high frequency PCB design tips for PCB interconnect. If you are familiar with these methods, you will understand that the coplanar microstrip design with copper cladding on the back is more economical and practical than the strip design.
usually higher than the solder melting point (183°C)50°C~60°C in most cases refers to the temperature of the solder furnace actual operation, the welded PCB solder joint temperature is lower than the furnace temperature, this is because of the PCB heat ab
In the layout of circuit modules, on the one hand, it is necessary to pay attention to the clock circuit and crystal oscillator circuit to reach the target through the shortest path.
The thickness of PCB board should be determined according to the function of PCB board, the weight of the mounting components, the specifications of PCB board socket, the outline size of PCB board and the mechanical load to be borne.
In order to suppress the cross talk between the printed circuit board wires, in the design of wiring should be as far as possible to avoid long distance equal wiring, as far as possible to open the distance between lines, signal lines and ground and power
PCB stacking PCB design principles. The most efficient way to stack boards is to arrange the main ground (the main ground) in the second layer below the surface, and to arrange RF lines on the surface as much as possible.
Under normal circumstances, for the circuit below the microwave frequency band (including low frequency and low frequency digital circuit), careful planning under the premise of a comprehensive grasp of various PCB design principles is the guarantee of on
The above DFM general technical requirements (single and double panel part) are only for the reference of Shenzhen Honglijer for customers in the design of PCB files, and hope to negotiate and reconcile with each other on the above aspects, in order to be
Whether the size of the printed board is consistent with the size of the processing drawings, whether it meets the requirements of the PCB manufacturing process, and whether there is a behavior mark.
In order to facilitate the installation and maintenance of the circuit, the required logo pattern and text code are printed on the upper and lower surfaces of the printing board, such as component label and nominal value, component outline shape and manuf
Telegram