n electronic product that does not conform to EMC specifications is not an acceptable electronic design. In addition to meeting market functional requirements, design products must also adopt appropriate design techniques to prevent or relieve EMI effects
In practical EMI shielding, the electromagnetic shielding efficiency depends largely on the physical structure of the chassis, namely, the continuity of conduction. The seams and openings in the chassis are leakage sources of electromagnetic waves.
Here, it is temporarily classified into two categories: one is electrical related safety spacing, one is non-electrical related safety spacing.
Our electronic products are often more than 60% - reliability problems are in the PCB design of the electronic circuit board; Relevant theoretical and practical experience is required for working and performing PCBS;
In the high-speed era, the ideal wiring on any section of schematic diagram has become an unsatisfactory wiring on PCB, bringing a variety of unexpected high-speed problems. Therefore, PCB engineers also need to accumulate experience and theoretical knowl
For circuits with large redundancy of power pins, the number of matched capacitors can also be calculated according to the number of output pins, and every 5 outputs is matched with a 100nf filter capacitor.
The above conclusions are similar when the power source ground distance is less than 10mil. However, when the power source is located at 20mil or even 50mil, the situation changes slightly. As shown in Figure 3, when the ground distance of the power suppl
In the typical radiation case of EMC testing and rectification, common-mode voltage parasitic between analog circuit and digital circuit is the main reason for the formation of common-mode radiation.
thanks to a deep control area and copper plating on the board, produced a bizarre scene during welding, where the board bubbled in layers. Is the processing of the design, or ignoring the welding process, please see today's case analysis.
High-speed public number are engaged in high-speed PCB design (Layout) of the small partner, signal processing theory may not help these friends in their daily work is not too much, these friends may pay more attention to the topic related to wiring.
Another common problem with EMI generation when PCB wiring is changing the reference plane layer without specifying a closed physical path for the signal PCB routing of the return current.
the traditional physical plate making method is labor-intensive, time-consuming and has low precision, while the chemical rapid plate making method has a controllable precision, but the process is complicated and unfavorable to environmental protection. B
