these devices must acquire higher clamp voltages and switching frequencies, with the accompanying heat dissipation capability. Here, we consider the influence of different cooling PCB pads on IGBT thermal performance under different working conditions.
On the printed circuit board, the electrical connection of all components is carried out through the pad. Pad is the most important basic unit in PCB design.
The general PCB basic design process is as follows:Preliminary preparation →PCB structure design → mesh guide → rule setting →PCB layout → Wiring → Routing optimization and silk screen → Network and DRC inspection and structure inspection → light drawing
Double-sided PCB extends from the substrate surface to both sides are composed of line layer, solder resistance layer, character layer, and through the drilling layer through the top bottom line to achieve connected electrical ventilation. In the actual p
With the PCB design time is shorter and shorter, the size requirements are smaller and smaller, and the device density is higher and higher, the PCB design is more and more difficult. Many manufacturers tend to use special EDA tools to achieve PCB design.
With the decrease of signal rising time and the increase of signal frequency, we pay more and more attention to EMI problems of electronic products. Almost 60% EMI problems can be controlled and solved by high-speed PCB.
Designing high-speed systems requires not only high-speed components, but also genius and careful design.
PCB technology is very complex, involving many aspects of the problem, whether in the design stage or the production stage, there are a lot of problems need to be answered.
he PCB hole is mainly composed of the hole, the bright plate area around the hole, and a part of the power layer isolation area. In high speed PCB design, it is often necessary to use multi-layer PCB, and the hole is multi-original.An important factor in
Copper coating has advantages and disadvantages. PCB design for two layer board, high resistance loop, multilayer board (microstrip line), copper coating is very necessary. For multilayer high speed digital circuits with a complete power supply and ground
Some customers have designed contour lines for Keep layer, Board layer, Top over layer and so on, and these contour lines do not coincide, which makes it difficult for pcb manufacturers to judge which contour line shall prevail.
After PCB production, SMT welding can be carried out directly, which brings great convenience to customers and saves cost. Through technology integration, quality can be improved to a greater extent, and quality problems can be eliminated in the bud.
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