In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.
it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.
The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products
In addition, bismale PI's friction and wear characteristics are also extremely superior, and it can also have a certain degree of wear resistance for applications that are easy to wear.
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Factors leading to uneven processing of FPC patch: 1. FPC deformation; 2. 2. Thickness and position of attached materials; 3. FPC strengthen the thickness of the plate or the back glue
PCB hard board and FPC soft board difference: 1. Rigid PCB: often used as motherboard, cannot bend, 2. Flexible board: FPC also known as flexible circuit board, can be bent
Printed circuit boards consist of electrically conductive tracks that interconnect components on the board. They are also commonly used for electrical safety testing or verification
Flexible PCBS (FPCS) are increasingly needed, and PCB manufacturers are accelerating the development of thinner, lighter and more dense FPCS.
in the design of PCB, it is necessary to pay attention to the design of PCB pad.
Traditional hard board material is hard, can not adapt to the development of electronic products miniaturization, high density, light weight.
In recent years, with the rapid development of PCB manufacturing process, the industry has put forward higher requirements for FPC. Precision PITCH is the main breakthrough direction of FPC in the future.
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