PCB Return Path Design: 8 Checks to Reduce EMI and Signal Integrity Risk
Learn eight practical PCB return path checks that help reduce EMI, crosstalk and signal integrity problems before Gerber files are released.
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High Speed PCB design Ten tips for PCB lamination design
The classic PCB laminated design is almost all even layers, rather than odd layers. Even layers of printed circuit boards have cost advantages, and even layers can avoid board warping more than odd layers.
High speed PCB crosstalk analysis and its minimization
Higher signal frequency, steeper edge, smaller printed circuit board size and higher wiring density make the influence of crosstalk in high speed PCB design significantly increase.
Signal reflux and cross division in high speed PCB
IC1 is the signal output end, IC2 is the signal input end (for the simplified PCB model, it is assumed that the receiving end contains the underlying resistance) and the third layer is the stratum.
High Speed PCB Signal Integrity Analysis and Design
High Speed PCB Signal Integrity Analysis and Design With the rapid innovation of integrated circuits and other related communication technologies, the frequency requirements for signal clocks that need to be equipped with various electronic devices co
High speed PCB design based on Cadence
Generally, the parameters of PCB board layer, the distance between signal lines, the electrical characteristics of the driver end and the receiver end, and the terminating mode of signal lines all have certain influence on the crosstalk.
Discussion on EMI Rules of high speed PCB Design
High-speed signal networks, such as clock signals, produce closed-loop results when multi-layer PCB lines are routed. Such closed-loop results will generate ring antennas and increase EMI radiation intensity.
Analysis of common problems and solutions in high speed PCB design
High speed digital circuit analysis generally only deals with multilayer PCB with complete plane layer. 2D field extraction analysis is used to consider only signal reflux in adjacent planes, and the hole is only treated as R-L-C of a lumped parameter.
Impedance matching in high speed PCB design
Characteristic impedance is related to PCB wire layer, PCB material (dielectric constant), wire width, distance between wire and plane and other factors, and has nothing to do with wire length.
The basic principle of DC power supply design in high speed PCB design
Power part and control part separate layout, power circuit is generally large voltage, large current, high power circuit, relatively large interference. And the control circuit is low voltage, if the control part to the power part, the control part is ver
Rule five Routing direction rules for high speed PCB design
In high speed PCB design, the circuit board characteristic impedance control and multi-load topology design directly determine the success or failure of the product.
Several matters needing attention in the design of high speed PCB through hole
Through the above analysis of the parasitic characteristics of the holes, we can see that in high-speed PCB design, seemingly simple holes often bring great negative effects to the circuit design.
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