The general PCB basic design process is as follows:Preliminary preparation →PCB structure design → mesh guide → rule setting →PCB layout → Wiring → Routing optimization and silk screen → Network and DRC inspection and structure inspection → light drawing
Double-sided PCB extends from the substrate surface to both sides are composed of line layer, solder resistance layer, character layer, and through the drilling layer through the top bottom line to achieve connected electrical ventilation. In the actual p
pcb board quick proofing is generally charged according to the information provided by customers and process requirements. For example: the number of boards, process requirements, ink color, board thickness, difficulty, expediting time and so on, a compre
Design used to pay attention to the visual effects of the board, now is different. The automatic circuit board design is not as beautiful as the manual design, but the electronic characteristics can meet the requirements, and the complete performance of t
With the PCB design time is shorter and shorter, the size requirements are smaller and smaller, and the device density is higher and higher, the PCB design is more and more difficult. Many manufacturers tend to use special EDA tools to achieve PCB design.
Avionics and PCB board development requires special consideration and timely action to ensure that your design and manufacture meet aerospace industry standards.
Compared with earlier standard ceramic materials, the new technology ceramics have improved durability, inertness and chemical properties. Even the physical properties have changed. Ceramic materials do not break down, soak or absorb moisture in large qua
The director of Fufu Electronics pointed out today that this cash reduction plan is expected to be implemented in the fourth quarter after the completion of various application procedures to the competent authorities.
The miniaturization and thinness of electronic equipment inevitably use flexible PCB and rigid flexible combined PCB. With the expansion of applications, there will be many new performance requirements in addition to the increasing number of applications.
In order to improve the technical performance of the printed circuit board, we must first improve the performance of the printed circuit substrate board, and ensure the demand for high density and fine wire, copper foil, laminated insulating dielectric sh
Reducing supply chain disruptions, new product launches stimulate demand, regionalization and localization, decoupling will continue, memory oligopoly competition heating up, more companies adopt Arm and RISC-V architecture, Moore's Law is not only contin
The main heat dissipation methods of electronic components include natural heat dissipation or cooling, forced heat dissipation or cooling, liquid heat dissipation, cooling of heat dissipation or cooling, energy channeling in heat dissipation or cooling.
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