Copper foil for electrodeposited copperfoil in English, is copper clad (CCL) and printed circuit board (PCB) manufacturing of important material. In the rapid development of today's electronic information industry, electrolytic copper foil is known as the
PCB materials have incomparable advantages compared with other materials. Suitable for power component surface mount SMT public art. Without heat sink, the volume is greatly reduced, the heat dissipation effect is excellent, good insulation and mechanical
PCB materials have incomparable advantages compared with other materials. Suitable for power component surface mount SMT public art. Without heat sink, the volume is greatly reduced, the heat dissipation effect is excellent, good insulation and mechanical
PCB materials have incomparable advantages compared with other materials. Suitable for power component surface mount SMT public art. Without heat sink, the volume is greatly reduced, the heat dissipation effect is excellent, good insulation and mechanical
the circuit board must be flame resistant, can not burn at a certain temperature, can only be softened. At this time, the temperature point is called the glass transition temperature (Tg point), and this value is related to the size and durability of the
The synchronous mode is to send two PCBS of the same size into the mounting area synchronously by the double track for mounting, and the asynchronous mode is to send PCBS of different sizes to the mounting area respectively.
SMT increases the PCB layout density, reduces the number of holes, decreases the area, and reduces the number of PCB layers with the same function, which reduces the manufacturing cost of PCB.
Once encountered because of the poor environment, the dust inside the display is thick, and when the weather turns tide, the circuit board is caused by short circuit ignition and damage to the display.
Finally, when carrying out the PCB component layout of the LED switching power supply, it is recommended that engineers arrange the position of each functional circuit unit according to the circuit process, such a layout can make the signal flow more effe
according to the storage time of PCB and components and the degree of surface oxidation to select the solder paste activity.
Thermal expansibility. The aluminum substrate can improve the heat dissipation function of the product, thus easing the thermal expansion and contraction of the components on the printed board, while improving the reliability of the product and making the
Packaging refers to the circuit pin on the silicon chip, with a wire connection to the external junction, in order to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips.
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