High frequency PCB board
Transmission delays on ground and interconnect lines in high-speed systems are also factors to be considered in system design.
Transmission delays on ground and interconnect lines in high-speed systems are also factors to be considered in system design.
Only when the digital signal is routed on top of the analog portion of the circuit board or the analog signal is routed on top of the digital portion of the circuit board will the interference of the digital signal to the analog signal occur.
The milling technology of NC circuit board milling machine includes the selection of cutting direction, compensation method, positioning method, frame structure, the next cutter point, which is an important aspect to ensure the milling precision.
PCB as the support body of electronic components, its surface needs to be welded components, it requires a part of the copper layer exposed for welding. Hence the need to brush solder resistance paint.
When the copper wire on PCB board is soaked in etching liquid for a long time, it will cause some fine line backing zinc layer to be completely reacted off and separated from the substrate, that is, the copper wire falls off.
The quality of PCB directly affects the quality of the whole electronic products, PCB testing is a timely detection of problems, but also a necessary means to prevent more defective products to reduce losses.
PCBA processing and welding process requirements for PCB board: 1. Heat resistance, 2. PCB shape, 3. PCB size, 5. PCB process edge, 6. PCB reference identification point, 7. Plate design, 8, can withstand solvent washing
Whether in the manufacturing and assembly process or in actual use, PCB to have reliable performance, this is very important.
The high floor board uses high TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials, which puts forward high requirements for the inner line fabrication and graphic size control.
The purpose of testing PCB board is to find out the defects of PCB board and repair them to ensure the production quality of PCB board and improve the qualified rate of products.
PCB design impedance matching: PCB design impedance matching refers to a suitable collocation between the signal source or transmission line and the load. According to the access mode PCB design impedance matching has serial and parallel two ways; Accordi
First, clean the cured photosensitive film on the PCB. It is then cleaned of excess copper foil covered with a strong alkali. The tin coating on PCB layout copper foil is then removed with destin solution. After cleaning, complete the 4-layer PCB layout.