Many people misunderstand the concept of PCB copying board. In fact, with the continuous development and deepening of the copying board industry, today's concept of PCB copying board has been extended in a wider range.
The onboard antenna needs to be placed at the edge of the board and where the antenna area is located. Copper foil exclusion zones are required for all layers, and the antenna should be separated from the ground plane of the PCB.
The dimensional stability of multilayer PCB is the main factor affecting the positioning accuracy of the inner layer. The effect of thermal expansion coefficient of substrate and copper foil on the inner layer of multilayer PCB is also considered.
Rich experience in copying board on the basis of guaranteed success rate, but also can finish the work of copying board faster. High efficiency and high success rate make subroutine electronics highly praised in the industry.
Copper coating can not only reduce the ground impedance, but also reduce the cross-sectional area of the loop and enhance the mirror loop of the signal. Therefore, copper coating process plays a very key role in PCB process, incomplete, truncated mirror l
After a lot of practice, the traditional aluminum plug process is changed, and white mesh is used to complete the circuit board surface welding and plug holes. Stable production and reliable quality.
This article is a summary of the author's experience in the actual development, hoping to help many RF IC developers shorten the development cycle, avoid unnecessary detours, save manpower and financial resources
it is necessary to pay attention to the maintenance order so as to find the shortest path to solve problems, so as to avoid poking and dismantling randomly, which will fail to repair and otherwise lead to greater faults.
PCB board surface bubbling may be the problem of poor binding force on the board surface, and then extension is the surface quality of the board.
The industrial pcb circuit board belongs to the industrial control industry, mainly the PCB mother board used in industrial applications, its structure usually has many card slots, a large area, a higher degree of modularity, can adapt to a wide range of
The signal layers are all layers with electrical connections, which is the actual copper layer. Intermediate layer refers to the intermediate plate layer used for wiring, in which the wire is distributed.
The generation of grooving can be summarized into the following two cases :1. Grooving caused by power/ground plane segmentation; 2.the through hole is too dense to form grooves.
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