The patch pin accurately detects the area of the pad contact pin to avoid affecting the welding 7. Through hole pinAccurately detect the hole size and number of attributes of the through hole pin to avoid the purchase of components cannot be used 8. Press
For circuit boards with components on both sides, consider that the second reflow soldering will wipe off the components on the soldered side.
First of all, we must optimize the key signal wiring on the PCB to avoid EMI problems, more than the layer change hole, we can punch a ground hole around the key signal hole to provide additional return path for the key signal hole
From the point of view of welding PCB design should pay attention to the problemsFrom PCB design to the completion of all components welding into a high quality circuit board, PCB design engineers and even the level of welding process, welding workers and
Do not wire under the crystal oscillator to ensure that the floor is completely paved, and do not wire within the 300mil range of the crystal oscillator, which can prevent the crystal oscillator from interfering with the performance of other wiring, devic
t present, in PCBA processing, the introduction of advanced testing equipment for quality control of the production process. In the process of reflow welding, AOI testing equipment is generally used for quality control.Can provide the smallest package 020
Our conclusion above is that it's better to go through a bigger hole. At this point, we need to introduce you to two formulas. One is the calculation formula of the parasitic capacitance through the hole: C=1.41εTD2/ (D1-D) The other is the calculation fo
The classic PCB laminated design is almost all even layers, rather than odd layers. Even layers of printed circuit boards have cost advantages, and even layers can avoid board warping more than odd layers.
The layout of the components should be convenient for signal flow, so that the signal is as consistent as possible. In most cases, the flow direction of the signal is arranged from left to right or from top to bottom, and the components directly connected
the power plane should be inside the PCB, and the upper and lower layers adjacent to him are 0V planes, and the distance between the two 0V flat faces should be at least 20 times the distance between them and the power plane.
This line width is generally satisfied for the conventional design, then we can compare the two layers, you will find that the difference between them is that the core is thinner, and then the pp sheet of one or two layers and five or six layers is also t
when the customer requires the top bottom to write copper words, line copper word line width: HOZ base copper: character width of more than 8mil, height of more than 45mil; 1OZ base copper: more than 10mil character width; Height above 50mil. At the same
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