Impedance matching in high speed PCB design
Characteristic impedance is related to PCB wire layer, PCB material (dielectric constant), wire width, distance between wire and plane and other factors, and has nothing to do with wire length.
Characteristic impedance is related to PCB wire layer, PCB material (dielectric constant), wire width, distance between wire and plane and other factors, and has nothing to do with wire length.
Adjacent to these connection points, a pad or mounting hole for mounting is placed between the case ground and the circuit ground. These ground connections can be cut open with a blade to keep the circuit open, or a jump with a magnetic bead/high frequenc
The basic concept of microstrip theory and the concept of microwave RF circuit and PCB design is actually an application aspect of microwave double transmission line theory.
Power part and control part separate layout, power circuit is generally large voltage, large current, high power circuit, relatively large interference. And the control circuit is low voltage, if the control part to the power part, the control part is ver
In addition, whether the need for special treatment, such as copper foil, shielding, etc., also need to be considered in the PCB design stage.
When the PCB wiring width changes, it should be carefully analyzed according to the actual situation to determine whether it will cause any impact. There are three parameters to be concerned about: how much impedance change, how much signal rise time, and
Test purpose: As PCB may be used in sea or seaside areas with high salinity in the air, its function will be affected due to poor salinity resistance, and serious accidents will be caused.
For RF-PCB wiring, each adjacent signal line (including adjacent planes) is formed to follow the basic principle of double line features (this will be explained later).
Antenna return signal loss is an important consideration in RF and microwave PCB design. The return loss of any RF and microwave PCB board is defined as the power ratio between the forward and reflected waves at a given frequency.
In high speed PCB design, the circuit board characteristic impedance control and multi-load topology design directly determine the success or failure of the product.
Once the CAD library, circuit board outline, and other setup tasks are complete, the design can begin to lay out. The first step in this process is to place the PCB component package on the board. Placing components on the board must meet three main requi
When the temperature or pressure of the target environment is higher than the warning value, it will notify the user through the cloud, so that the user can know the situation of the target environment in the first time.