PCB electroplating technology classification process and precautions
The process parameters related to copper electroplating of full-board PCB adopt a high-acid and low-copper formula to ensure the uniformity of plate thickness distribution.
The process parameters related to copper electroplating of full-board PCB adopt a high-acid and low-copper formula to ensure the uniformity of plate thickness distribution.
The main components of the bath are copper sulfate and sulfuric acid, and the formula of high acid and low copper is adopted to ensure the uniform thickness distribution of the plate and the deep plating ability of deep holes during electroplating.
Copper plating is the most widely used in order to improve the adhesion of the coating and a kind of precoating, this paper we will introduce the copper plating technology in PCB process encountered common problems and their solutions.
printing material dry too fast, in the screen version dry plugging hole, printing speed is too fast, scraper strength is too high. Solution, should use volatile organic solvent slow printing material, with soft cloth stained with organic solvent gently cl
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