In the PCB layout, the power decoupling circuit should be designed near the relevant circuits, rather than placed in the power supply part, otherwise it will affect the bypass effect, and will flow pulsating current on the power line and ground wire, caus
The heat source has a great impact on the performance and reliability of the PCB. In the layout design, it is necessary to avoid the thermal effects of excessive density and higher power components on the PCB
In this example of a four-layer PCB board, the designers used a solid ground plane located directly below the device, and the board was divided into analog and digital sections to keep sensitive inputs and reference signals away from noise sources.
While this strategy is successful, it is also limited by the amount of load on the application processor, and these additional features will force PCB designers to consume more power and more computing resources.
PCB layout of the power circuitThe power circuit is an important part of an electronic product, and the design of the power circuit is directly related to the performance of the product. The power supply circuits of our electronic products mainly include
Layout is one of the most basic skills of PCB design engineer. The quality of the wiring will directly affect the performance of the whole system, most of the high-speed design theory will be finally realized and verified by Layout.
Place pcb components at any Angle:Double-click the component and there is a parameter called Rotation. It's the Angle of rotation. Choose the Angle you want.
After careful consideration and prediction, the design of online circuit testing can be carried out at the early stage of design and realized at the later stage of production process.
When proprietary liquid resist is used in conjunction with CL coater, the intent is to save PCB manufacturers significant time and money, as well as improve the quality of the final product and reduce defects.
High Density Interconnect (HDI) is a technique for creating high speed and high density PCBS. HDI uses blind and buried holes to increase signal density and thus improve the performance of printed circuit boards.
The size of the digital circuit output current Ioh pulled from the power supply at high voltages and the current Iol injected at low voltages is generally different, that is, Iol > Ioh.
Too low density of alkaline etching solution will aggravate side erosion, choosing etching solution with high copper concentration is very beneficial to reduce side erosion.
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