How to reduce PCB board space with the smallest device?
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
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PCB circuit board processing and production difficulty in where?
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
PCB A balanced laminated design of printed circuit boards
In the core structure, all the conductive layers in the circuit board are coated on the core material; In the foil-coated structure, only the internal conductive layer of the circuit board is applied to the core material, and the external conductive layer
PCB printing
The progress and development of copper clad plate is also driven by the innovation and development of electronic machine products, semiconductor manufacturing technology, electronic installation technology and PCB manufacturing technology. In this case, c
From PCB to IC carrier to class carrier
In order to achieve the smaller space, faster speed, higher performance of the goal, the printed circuit board "light, thin, short, small" requirements continue to improve, PCB board structure requirements continue to improve.
PCB board factory, design high frequency impedance circuit board what are the special methods
If the transmission line is isotropic, there will always be a current as long as the signal is transmitted.
Common PCB board substrate analysis
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
Crosstalk in PCB design
The simultaneous dumping of current underground may temporarily raise the ground's electrical potential, causing a change in reference, a phenomenon known as ground rebound. The main conditions that affect grounding bounce include load capacitance, socket
How does a good PCB layout help you build high quality boards faster
an all-digital system may not have a separate analog power plane, and adding a new power plane can become prohibitively expensive unless the designer creates a partitioned island or separate plane on top of the existing layer.
How to design the high frequency PCB board of microwave circuit?
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
What is the difference between PCB board surface treatment gold plating and gold plating process
Gold deposition is used by chemical deposition, through the method of chemical REDOX reaction to generate a layer of coating, generally thick, is a kind of chemical nickel gold deposit method, can reach a thicker gold layer.
Circuit board design: PCB size and shape requirements
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
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