How to ensure the quality of PCB processing: one: pressure (patch height) - patch pressure (height) should be appropriate, two: correct components - required assembly position number, three: accurate position - the end or pin of the components and pad gra
The onboard antenna needs to be placed at the edge of the board and where the antenna area is located. Copper foil exclusion zones are required for all layers, and the antenna should be separated from the ground plane of the PCB.
PCB circuit boards play an important role in life today. It is the foundation of electronic components and the highway. In this regard, the quality of the PCB is critical.To check the quality of a PCB, a number of reliability tests must be performed. The
The dimensional stability of multilayer PCB is the main factor affecting the positioning accuracy of the inner layer. The effect of thermal expansion coefficient of substrate and copper foil on the inner layer of multilayer PCB is also considered.
Rich experience in copying board on the basis of guaranteed success rate, but also can finish the work of copying board faster. High efficiency and high success rate make subroutine electronics highly praised in the industry.
The oxidation of sunken gold plate is the contamination of the gold surface by impurities. The impurities attached to the gold surface change color after oxidation, which leads to the oxidation of the gold surface.
With the reduction of the aperture, the original debris that has no effect on the larger aperture, pcb board factory, such as brush debris, volcanic ash, once remaining in the hole, will make the chemical precipitation of copper, copper plating will lose
Even the well-written and actually implemented technical specifications for PCB laminates do not specify the test items that must be carried out to determine that PCB laminates are the cause of manufacturing process problems.
the data is also used to check the component function. The data provided by the development department should be as easy as possible to apply directly to the test system or through simple transformations.
Copper coating can not only reduce the ground impedance, but also reduce the cross-sectional area of the loop and enhance the mirror loop of the signal. Therefore, copper coating process plays a very key role in PCB process, incomplete, truncated mirror l
The wiring design of electronic components has more and more influence on whether the test can be carried out well in the manufacture process of PCBA. Here are some important rules and practical tips.
From the point of view of function, the hole can be divided into two categories: one is used as an electrical connection between the layers; The second is used for fixing or positioning devices. If from the process, through the hole is generally divided i
Telegram