We have excellent technology research and development team, advanced research and development equipment, professional research and development laboratory, according to the customer's personalized needs for PCB copy board, design and mass production, in th
pcb manual subdivision, milling cutter type subdivision, V-cut subdivision machine, punch subdivision machine, laser subdivision.
Provide mechanical support for fixing and assembling various electronic components such as integrated circuits, realize wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provid
Now there is a certain amount of competition in all walks of life, for businesses, or for ordinary consumers, want to choose a more suitable object of cooperation among many peers, in fact, it also needs the next work, such as when people choose pcb manuf
The circuit board is mainly composed of welding pad, through hole, mounting hole, wire, components, connectors, filling, electrical boundary and so on. Common board Layer structures include Single Layer PCB, Double Layer PCB and Multi Layer PCB
In the context of countries calling on the whole society to build a high-quality economic system, pcb board proofing manufacturers in the electronics industry have taken action, their in-depth research on modern technology and enough sincerity to treat cu
To draw simple boards, learn AD. If you want to paint consumer electronics, learn PADS. If you want to draw large boards, follow allegro.
pcb proofing is a must for the future production, because a lot of things need to be tested before mass production, otherwise there will be large-scale waste, but there are a lot of things to pay attention to in the early stage of proofing, otherwise it
Printed circuit board has good product consistency, it can adopt standardized design, conducive to the realization of mechanization and automation in the production process. At the same time, the whole printed circuit board can be used as an independent s
There should be no large device or protrude device near the connection point between the outer frame of the splinter board and the inner small board, and the small board and the small board, and the edge of the component and PCB circuit board should be mo
Laminated layer may appear uneven thickness, inner layer slip, plate surface pits, resin, folds, internal pattern change, dislocation between layers, foaming, plate warping, plate warping, delamination, thermal delamination, white exposed glass fabric.
Understand PCB design, PCB assembly and PCB layout in PCB related industries, and SMT passive component and PCB design target structure
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