The higher the Td, the slower the burn rate. Materials with Td equal to or below 300°C are suitable for eutectic tin-lead welding. Materials with Td above or above 300°C are more suitable for lead-free welding. In this case, the higher the Td value, the h
Challenge: Equipment is expected or required to maintain as uniform surface pressure as possible to improve the quality of processed products
Reflow welding: After the component is inserted, heat is started using an assembler. In this process, the plate is heated inside the reflow furnace by an assembler and the process continues until a solder joint is formed. This happens by providing the des
During the manufacturing process, various conditions can and will cause solder bridging. Welding Bridges can come from manufacturing equipment in use or even decisions made during the design process. Here are some of the more common reasons for solder bri
Assembly drawings vary according to different assembly templates. Most of the time, because electronic products use the printed circuit board described below, the printed circuit board diagram is the main form of assembly diagram
Circuit Analysis capabilities Many of today's leading EDA programs lack extensive circuit analysis capabilities. It is useful to provide PDN information or heat distribution; However, advanced circuit analysis capable of performance testing is a distinct
Here will be an overview of some of the methods, materials, software, and tools available to produce PCBS, and hopefully it will be able to help you get started designing PCBS
Suitable paper is used to print the design and transfer it to bakelite, we will use vinyl support paper for labels, another one that gets very good results is adhesive paper support.
Paneling via flange wiring of a perforated material bridge: This process is similar to the simple flange wiring described above. However, the material bridge here has additional holes drilled, which greatly simplifies the separation process and also provi
In addition, the high cost of construction also directly restricts the popularity of domestic new energy vehicles. Therefore, we can use reverse research and development technology to carry out PCB copying research, and we can seek new ways to reduce prod
the core board (GND to POWER) should not be too thick to reduce the distributed impedance of the power supply and ground plane; Ensure the decoupling effect of the power plane.
In order to ensure the high quality and high stability of the printed circuit board, to achieve the total quality management of the PCB factory and the control of the environment, it is necessary to fully understand the characteristics of the printed circ
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