For high - level circuit board processing technology research literature, the industry is relatively few. This paper introduces the control points of key production processes, such as material selection, laminated structure design, interlayer alignment, i
In addition, in winter, when the tank liquid in some factories is not heated, special attention should be paid to the live into the tank of the production process, especially the plating tank with air stirring, such as copper nickel
The correct detection, measurement and analysis of "burst" mode wireless signal is a very meaningful work for SI design.
this chapter aims to help you understand the new techniques of wireless signal testing, and it also provides some new ideas for signal analysis in modern wireless environments.
Components with large heat or current should not be placed in the corners and edges of PCB board, and radiators should be installed as far as possible, and away from other devices, and ensure that the heat dissipation channel is smooth.
In the high-speed design, we must consider the capacitance of the parasitic parameters, quantitative calculation of the number of decoupling capacitors and the capacity of each capacitor and the specific position of the placement, to ensure that the imped
Returning to the PCB proofing market, price is the first indicator for customers to choose products, but in the future, with the gradual standardization of PCB industry standards, it will be difficult to attract repeat customers by relying on low price an
It is impossible to predict exactly where PCB surface treatment technology will go in the future. Anyway, to meet customer requirements and protect the environment must be done first!
Therefore, electroless nickel plating/gold leaching is to coat the copper surface with a thick layer of good electrical nickel gold alloy, which can protect the PCB for a long time; In addition, it has environmental tolerance that other surface treatment
The impedance and loss of PCB are crucial to the transmission of high-speed signals. In order to analyze such a complex transmission channel, we can study its impact on signals through the impact response of transmission channel.
The shelf life of PCB made by OSP process and pure gold sinking process is generally 6 months after packaging. Baking is not recommended for OSP process.
It can be seen that the coordination between welding aid and welding resistance pad design plays a decisive role in improving PCBA manufacturability and welding pass-through rate.
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