Copper foil for electrodeposited copperfoil in English, is copper clad (CCL) and printed circuit board (PCB) manufacturing of important material. In the rapid development of today's electronic information industry, electrolytic copper foil is known as the
The OC48 interface card contains several typical mixed-signal PCB layout and routing problems, the layout and routing process will indicate the sequence and steps to solve the mixed-signal PCB layout solution.
The circuit board is mainly composed of welding pad, through hole, mounting hole, wire, component, connector, filling, electrical boundary and so on.
Special substrate printed circuit board Metal substrate (aluminum base, copper base, iron base or invar steel), ceramic substrate, according to its characteristics, use can be made of metal (ceramic) based single, double, multi-layer printed circuit board
As a power supply product, PCB circuit boards can be seen everywhere in life. This requires manufacturers to strictly put the quality in production, understand all the failure of the product, deal with it early, and reduce economic losses.
PCB circuit board with insulation board as the base material, cut into a certain size, it is accompanied by at least one conductive graphic, and cloth holes (such as component holes, fastening holes, metallization holes, etc.), used to replace the chassis
It is divided into PCB electroplating hard gold (gold alloy) and water gold (pure gold) process, hard gold plating and soft gold bath liquid composition is basically the same.
Printed circuit board (PCB circuit board), also known as printed circuit board, is a provider of electrical connections for electronic components. It has a history of more than 100 years.
The process parameters related to copper electroplating of full-board PCB adopt a high-acid and low-copper formula to ensure the uniformity of plate thickness distribution.
Do you know PCB cleaning technology? Here are some tips to share.
In production, sometimes encounter some customers, require part of the hole plug hole, but can not be fully plugged, the back of the plug hole solder window, and depth requirements, commonly known as "PCB half plug hole".
Further said, sulfuric acid-hydrogen peroxide, can not be used for lead tin corrosion resistance layer etching, and this process is not the main method in the production of PCB outer layer, so most people rarely ask.
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