The deformation of the circuit board (PCBA board) usually comes from the rapid temperature rise and rapid temperature drop (thermal expansion and cold contraction) caused by Reflow。
usually in the process of high-speed PCB design, the seemingly simple holes usually bring great negative effects to the circuit design.
The cost calculation of PCB industry is the most special and complex in all industries. From opening, platen, forming, to FQC, packaging, completion and warehousing.
in fact, repair maintenance cost greatly increased at the same time, customer brand affected, It doesn't pay off in the long run.
the temperature reproducibility can be obtained through multiple tests, so as to systematically evaluate the performance of the press.
Electrical testing is a very important link in the PCB board manufacturing process, the purpose is to check whether the PCB board is open and short circuit problem, to ensure that the finished products in line with the customer's electrical performanc
For electronic equipment, a certain amount of heat will be generated during work, so that the internal temperature of the equipment will rise rapidly.
In this process, all surface areas and boreholes are plated with copper, some resistance is poured on the surface of the unwanted copper, and then etching resistance metal is plated.
The performance, quality, processability, manufacturing level, manufacturing cost and long-term reliability and stability of PCB depend largely on the copper clad plate material.
PCBA processing of aluminum substrate manual soldering wire points for attention: first, pay attention to the welding temperature, two, select the appropriate raw materials, three, with the iron head is harmful to spot welding force
When the field strength of electromagnetic field exceeds a certain limit and the operation time is long enough, it may endanger human health. It can also interfere with other electronic devices and communications. All of these need to be protected.
PCB circuit board fault detection methods: 1, determine the fault location, 2, detection equipment, 3, visual and physical detection, 4, special detection components, 5, on the circuit board for detection, 6, low voltage measurement
