PCBA processing wave soldering points for attention
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
In case of tinning, corresponding measures should be taken: 1. Adjust welding process parameters: 2. Replacement of solder alloy: 3. Replacement of components: 4. Check the surface treatment of PCB board and components: 5. Inspection equipment
How should PCBA processing plant do a good job in component procurement: 1. PCBA component procurement channels; 2. PCBA component quality control; 3
It is mainly because the thin welding paste is more likely to form a larger cavity, or the thickness gap of the weld is too small, leading to the volatiles of the welding machine more difficult to discharge through this "channel", so that the pr...
In the through-hole PCBA assembly technique, the component is inserted into the drilled hole and a strong solder joint is formed by wave soldering. Usually, through - hole components are inserted manually
The reasons for the appearance of virtual welding in PCBA processing are as follows: 1. Oxidation of pad and component pins; 2. Less tin; 3. The temperature is too high or too low, 4 welding paste melting point is low, 5, solder paste quality problems
PCBA processing on the workshop environment specific requirements: one, temperature, humidity requirements, two, ventilation capacity, three, power requirements, four, electrostatic protection requirements
PCBA processing requirements for PCB board; 1, PCB size,2, PCB board side width,3, PCB bending,4, PCB board Mark point,5, PCB welding pad
The process process of PCBA can be roughly divided into four main links: SMT patch processing →DIP plug-in processing →PCBA testing → finished product assembly
According to the welding pad surface treatment classification: organic weldability protection layer (OSP), nickel metal leaching (ENIG), nickel palladium leaching (ENEPIG), silver Immersion silver, tin immersion.
PCBA machining functional test process: 1. Functional test plan, 2. Test points, 3. System programming, 4. Test fixture