PCB fabrication is one of the most important steps for PCBA processing plant to complete the task quickly and accurately, including: the process design of the board, tooling design and production, the production of the circuit board
pcba aging test standards: 1, low temperature work, 2, high temperature work, 3, high temperature and high humidity work
The purpose of thawing back temperature: can make the flux and tin powder evenly distributed, so as to give full play to the various characteristics of tin paste; The viscosity and activity of the solder paste after refrigeration are different from that o
PCBA processing and welding process requirements for PCB board: 1. Heat resistance, 2. PCB shape, 3. PCB size, 5. PCB process edge, 6. PCB reference identification point, 7. Plate design, 8, can withstand solvent washing
The heating methods of reflow welding are generally divided into two categories: one is by the red lamp and adapted tube heater; The other type is ceramic plate, aluminum plate and stainless steel plate heater.
PCBA processing and SMT processing differenceThe whole process of PCBA processing actually includes SMT patch processing. SMT patch processing is only part of the PCBA process, which literally means a wider range of processes
Then SMT patch processing plant will generally do what reliability test of PCBA board: 1, push and pull test: 2, FCT test: 3, fatigue test: 4, ICT test: 5, simulation of automobile transportation vibration test: 6, environmental test test: 7, aging test
Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
PCBA in the manufacturing need to consider the issues :1, automatic production line veneer transmission and positioning elements design,2, PCBA assembly process design,3, component layout design,4, assembly process design
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
In case of tinning, corresponding measures should be taken: 1. Adjust welding process parameters: 2. Replacement of solder alloy: 3. Replacement of components: 4. Check the surface treatment of PCB board and components: 5. Inspection equipment
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