How does PCBA technology select solder paste for PCBA processing?
Knowledge about PCB components, PCB layout, PCB manufacturing in PCB industry How does PCBA technology select solder paste for PCBA processing?
Knowledge about PCB components, PCB layout, PCB manufacturing in PCB industry How does PCBA technology select solder paste for PCBA processing?
This article mainly introduces what SMT is, the difference between PCB and PCBA, what DIP is, and the difference between DIP and SOP
Knowledge about PCB design, PCBA production, PCB welding in PCB industryCharacteristics of Flux in SMT Chip Processing and PCBA Production
Low-volume PCBA assembly can provide high turnaround times without leaving PCBA boards stuck in high unusable inventory.
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What is Base Station GPS?What is a base station? A base station is a GPS receiver that collects GPS measurements at a known location. Its main components are an antenna, a GPS receiver, and a device that records GPS data - usually a personal computer.How
1. Introduction to RF PCB DesignIn the wireless communication system, only a small part of the front-end circuit works in the radio frequency stage, which is commonly known as the radio frequency front-end circuit. The rest of the circuit is used for low
What is high speed in PCB?In short, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board, such as layout, packaging, layer stacking, interconnects, etc…
High Speed Digital Design FundamentalsSo what is high-speed board design? High-speed design specifically refers to systems that use high-speed digital signals to transfer data between components. The line between high-speed digital designs and simple circ
Any Layer HDI PCB: This is the most complex HDI PCB design structure, where all layers are high-density interconnect layers, allowing free interconnection of conductors on any layer of the PCB with the copper-filled stacked microvia structure. This struct
HDI PCB (2+N+2): This is a moderately complex HDI PCB layout design structure that contains 2 or more high-density interconnect layers, allowing conductors and copper free interconnects on any layer of the PCB to fill the stack Microporous structure. Thes
For BGAs with smaller ball pitch and higher I/O countIncrease routing density in complex designsSheet CapabilityLower Dk/Df material for better signal transmission performancecopper filled viasApplications: Mobile phones, PDAs, UMPCs, portable game consol