Analysis of PCBA parts packaging technology
Analysis of PCBA parts packaging technologyPlug-in packaging technology surface adhesive packaging technology
Analysis of PCBA parts packaging technologyPlug-in packaging technology surface adhesive packaging technology
PCBA chip processing and assembly method and production processWith the development trend of electronic PCBA patch processing and assembly towards practicality and high assembly density, SMT surface patch technology has now become the mainstream technolog
Storage container: anti-static turnover box.Isolation material: anti-static pearl-cotton.Spacing: Leave a distance of more than 10mm between PCB boards and containers.
Concept Refers to the process of soldering and assembling electronic components on prefabricated matting and manufacturing printed circuit boards (PCBs).
The calculation of SMT chip processing points is the main basis for the calculation of processing costs. Many customers who have only come into contact with the SMT processing industry do not know how to calculate the price.
The current market situation of automotive electronics PCBA is that the pre-installation market is matched by the vehicle market itself, and the suppliers are generally subsidiaries or holding companies of their own companies.
A Complete Guide to Aviation PCBA Electronic Assembly and DesignYou've heard of many great feats and discoveries in the aerospace industry. You've also heard of tragedies that happen when design goes wrong.It's no surprise that aerospace manuf
The production qualification of PCBA patch processing plant is reflected in many aspects, such as whether there is ISO9001 quality management system certification, whether there is the United States UL certification, whether there is the European Union RO
ICT test fixtureICT test mainly includes circuit on-off, voltage and current values, wave curve, amplitude, noise, etc. 2. FCT test fixture 3. Fatigue test fixture 4. Environmental test equipment5. Age the test device
First, to perform SMT SMT processing, you need to have a dedicated SMT machine. Before you begin processing, you need to check the state of the patch machine and ensure that it is working properly. Checking the condition of the patch machine includes clea
The surface packaging technology is analyzed and studied for assembling the circuit board. And then we put it together and we make a finished product. That is to say printed circuit board blank after the patch
Formation mechanism: During reflow welding, the heating of chip components is heated at the same time. Generally speaking, the pad with the largest exposed area is first heated to a temperature above the melting point of the paste. In this way, one end of