The following seven factors that will affect welding are summarized: first, welding heating bridge, second, pin welding force, third, choice of soldering iron head, fourth, temperature setting, fifth, use of flux, sixth, transfer welding operation, sevent
The installation and welding of surface assembly parts are mainly divided into two basic technology methods, which are solder paste - reflow welding process - patch glue - wave soldering process
SMT patch factory control method of temperature and humidity sensitive elements: 1, environmental control, 2, process control, 3, control method
PCBA is one of the basic components of electronic components, PCB it through surface assembly technology (SMT), and the whole process of DIP plug-in insertion, known as PCBA process.
SMT patch processing solder paste need to pay attention to: 1, constant temperature: 2, delivery: 3, freezing :4, situation: 5, applied old solder paste :6, on the steel net paste amount:
The physical characteristics of flux refer to melting point, surface tension, viscosity, mixing and so on, which are related to welding performance.
The main adverse phenomena in the solder paste printing process of SMT patch processing are as follows:After printing, the solder paste is not enough and gradually spreads to the outside of the pad. Reason analysis: 1, the scraper pressure is too large, 2
Reflow welding has become the mainstream process of surface mounting, it depends on the influence of hot gas flow on the solder joint, colloidal flux in a certain high temperature air flow for physical reaction, achieve SMD welding, the quality of PCBA so
SMT patch processing PCBA overhaul includes what aspects: ① Check the electronic devices, each spot welding electronic devices are not wrong version, leakage, reverse problem exists, ② spot welding welding is not smooth, there is no abnormality, ③ query d
necessary to set up professional testing equipment in each process and strictly control the quality of the process
SMT patch processing what solder paste:First, there are lead and lead-free solder paste, two, high temperature solder paste, medium temperature solder paste, low temperature solder paste, three, tin powder particle size
Circuit board testing and printing pcb circuit boards are initially applied in paper-based copper-covered circuit boards. Since the appearance of semiconductor material audion in the 50's of the 20th century, the demand for circuit boards has increased si
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