What are the requirements of SMT processing on PCB board
This is the SMT processing of PCB board requirements, in the production of PCB board is not slack, the production
This is the SMT processing of PCB board requirements, in the production of PCB board is not slack, the production
The company gives full play to its competitive advantages in scale procurement and quality control, and has signed long-term cooperation agreements with many electronic component manufacturers at home and abroad and around the world to ensure the quality
SMT(Surface Mount Technology) is the most popular technology and process in the electronic assembly industry.
There are many SMT processing modes, different processing cooperation modes of the process is different, the corresponding customer needs to prepare things are not the same.
Special materials such as integrated circuits should be stored in anti-static drying cabinets, and special integrated circuits such as BGA should be baked before being placed.
In the electronics industry, PCBA processing mostly adopts SMT processing, and there are many common faults in the process of use.
High-end equipment can be attached to precision shaped parts, BGA, QFN, 0201 materials. Also can be template patch, loose material hand. Sample and size batch can be produced, proofing from 800 yuan, batch 0.008 yuan/point, no start-up fee.
When the PCB enters the insulation area, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature area and damaging the PCB and components.
In the first manned Apollo spacecraft, for example, an electrostatic discharge caused an explosion that killed three astronauts. Electrostatic discharge (ESD) in the process of gunpowder manufacturing, resulting in explosion casualties often occur.
the components on the PCB should be evenly distributed, especially the high-power devices should be dispersed to avoid local overheating stress on the PCB when the circuit is working, affecting the reliability of the solder joint.
Solvent cleaning is a commonly used method to remove excess tin residue. It is mainly through chemical reaction, the use of solvents to dissolve or separate the excess tin residue. In general, commonly used solvents include acids, bases, organic solvents
Improper temperature control: If the temperature is insufficient, the solder will not be completely melted, and the solder joint may not be rounded. On the other hand, if the temperature is too high, the solder joint may be deformed.