2, the spring tension is insufficient, the suction nozzle and HOLD are not coordinated, resulting in poor feeding;Solution: Maintain the equipment regularly according to plan, check and replace the wearing parts. 3. Deformation of HOLD/SHAFT or PISTON, be
In addition to the above advantages and disadvantages, solder paste and red glue are also different in terms of use and process flow. When using solder paste for SMT processing, it is usually necessary to use a printing press to evenly print the solder pa
FeedFeeding refers to feeding the components prepared in the preceding sequence in accordance with fixed procedures. At this stage, components need to be classified according to specifications, sizes, models, etc., and placed in the process location. Afte
Using outdated equipment and technology can result in too much or too little solder paste being applied to the pad, affecting the quality of the weld. Modern SMT plants usually use sophisticated equipment to apply the paste, such as printing presses and n
Before SMT processing, the device and the board need to be processed. For components, it is necessary to carry out pre-preparation, including cleaning, stripping, processing, etc., to ensure that its quality meets the requirements. For PCB board
In the electronics manufacturing industry, SMT (surface mount technology) is a very common process that allows the manufacture of electronic devices to become faster and more accurate. In the SMT processing process, there are many key processes that need
Strong maintenance ability and perfect after-sales service Experienced maintenance engineers can repair all kinds of patch welding caused by bad products, to ensure the connection rate of each piece of circuit board.
The calculation of SMT chip processing points is the main basis for the calculation of processing costs. Many customers who have only come into contact with the SMT processing industry do not know how to calculate the price.
Take the chip element with square pad design as an example, as shown in Figure 2 below. After the solder paste printing, if there is more solder paste, it is easy to produce tin beads.
Formation mechanism: During reflow welding, the heating of chip components is heated at the same time. Generally speaking, the pad with the largest exposed area is first heated to a temperature above the melting point of the paste. In this way, one end of
Another term we should avoid is touch-up. In this industry, many employees consider repair welding to be a normal and acceptable part of the assembly process. This is unfortunate, as rework and repair of any kind should be considered undesirable.
SMT patch processing technology popularity: A, electronic products small size, high assembly density. Two, high reliability, strong vibration resistance. Three, high frequency characteristics, reliable performance. Fourth, improve productivity and realize
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