Name: Copper substrate
Material: FR-4
Layers: 4 layers
Minimum aperture: 0.1mm
Plate thickness: 1.6mm
Copper Thickness: 2oz
Minimum line spacing: 0.065mm
Surface Treatment: Immersion Gold
8 layers thick gold PCB circuit board
Name: 8-layer thick gold PCB circuit board
Application field: power equipment
Material: Shengyi TG170-S1000
Layers: 8 layers
Plate thickness: 1.6mm±0.1mm
Minimum aperture: 0.5mm
Minimum line width/line spacing: 0.255mm
Copper Thickness: 5OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 5U
Product features: 5OZ copper + 5U gold
Name: 16-layer thick copper plate
Application field: railway field
Material: Shengyi TG170-S1000-2m
Layers: 16 layers
Plate thickness: 2.5mm±0.1mm
Minimum aperture: 0.2mm
Minimum line width/line spacing: 0.05mm
Copper thickness: 8OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 6U
Product features: 8OZ copper + gold thickness 6U
8 layers thick copper PCB circuit board
Name: 8-layer thick copper PCB circuit board
Application field: high-end equipment
Material: Shengyi TG170
Layers: 8 layers
Plate thickness: 3.0mm±0.1mm
Minimum Aperture: 0.25 Minimum Line Width/Line Spacing: 4mil
Copper Thickness: 3OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 5U
Product features: 3OZ copper + 5U gold
Name: 10mm extra thick PCB board
Application field: high-end server field of data center
Material: Shengyi TG170-S1000
Layers: 10 layers
Plate thickness: 10mm±0.1mm
Minimum aperture: 1mm
Minimum line width/line spacing: 1.5mm
Copper thickness: 8OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 8U
Product features: 8OZ copper + 8U gold
Name: Multilayer Thick Copper PCB
Layers: 4
Thickness: 3.0mm
Material: FR4 S1000-2
Size: 175*104mm
Surface Treatment: Immersion Gold
Line width/spacing: 12/12mil
Minimum aperture: 0.5mm
Solder mask color: photosensitive green
Finished copper thickness: inner layer 6 OZ, outer layer 6 OZ
Name: Multilayer thick copper plate
Material: Shengyi FR-4 TG170
Layers: 10 layers
Minimum aperture: 1.2mm
Plate thickness 3.2±0.25mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, high TG
Name: Thick copper power board
Material: Shengyi
Layers: 14 layers
Minimum aperture: 0.4mm
Plate thickness 3.0±0.2mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, metal edging, inductance control
- PCB Manufacturing Equipment
- Thick Copper PCB Capability
Thick Copper PCB Capability | |
Feature | Capability |
Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
Min. Track/Spacing | For External layers: 4oz Cu 10mil/13mil,5oz Cu 12mil/15mil 6oz Cu 15mil/15mil |
For Internal layers: 4oz Cu 8mil/8mil,5oz Cu 10mil/10mil 6oz Cu 12mil/12mil | |
Min. Hole Size | 0.15 ~ 0.3mm |
Max Outer Layer Copper Weight (Finished) | 13oz |
Max Inner Layer Copper Weight | 12oz |
Board Thickness | 0.6-6mm |
Surface Finishing | HASL lead free,Immersion gold, OSP, Hard Gold,Immersion Silver,Enepig |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
Silkscreen | White, Black |
Via Process | Tenting Vias,Plugged Vias,Vias not covered |
Testing | Fly Probe Testing (Free) and A.O.I. testing |
Build time | 5-15 days |
Lead time | 2-3 days |