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Name: Copper substrate
Material: FR-4
Layers: 4 layers
Minimum aperture: 0.1mm
Plate thickness: 1.6mm
Copper Thickness: 2oz
Minimum line spacing: 0.065mm
Surface Treatment: Immersion Gold
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8 layers thick gold PCB circuit board
Name: 8-layer thick gold PCB circuit board
Application field: power equipment
Material: Shengyi TG170-S1000
Layers: 8 layers
Plate thickness: 1.6mm±0.1mm
Minimum aperture: 0.5mm
Minimum line width/line spacing: 0.255mm
Copper Thickness: 5OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 5U
Product features: 5OZ copper + 5U gold
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Name: 16-layer thick copper plate
Application field: railway field
Material: Shengyi TG170-S1000-2m
Layers: 16 layers
Plate thickness: 2.5mm±0.1mm
Minimum aperture: 0.2mm
Minimum line width/line spacing: 0.05mm
Copper thickness: 8OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 6U
Product features: 8OZ copper + gold thickness 6U
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8 layers thick copper PCB circuit board
Name: 8-layer thick copper PCB circuit board
Application field: high-end equipment
Material: Shengyi TG170
Layers: 8 layers
Plate thickness: 3.0mm±0.1mm
Minimum Aperture: 0.25 Minimum Line Width/Line Spacing: 4mil
Copper Thickness: 3OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 5U
Product features: 3OZ copper + 5U gold
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Name: 10mm extra thick PCB board
Application field: high-end server field of data center
Material: Shengyi TG170-S1000
Layers: 10 layers
Plate thickness: 10mm±0.1mm
Minimum aperture: 1mm
Minimum line width/line spacing: 1.5mm
Copper thickness: 8OZ
Solder mask: green oil white characters
Surface Technology: Immersion Gold 8U
Product features: 8OZ copper + 8U gold
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Name: Multilayer Thick Copper PCB
Layers: 4
Thickness: 3.0mm
Material: FR4 S1000-2
Size: 175*104mm
Surface Treatment: Immersion Gold
Line width/spacing: 12/12mil
Minimum aperture: 0.5mm
Solder mask color: photosensitive green
Finished copper thickness: inner layer 6 OZ, outer layer 6 OZ
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Name: Multilayer thick copper plate
Material: Shengyi FR-4 TG170
Layers: 10 layers
Minimum aperture: 1.2mm
Plate thickness 3.2±0.25mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, high TG
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Name: Thick copper power board
Material: Shengyi
Layers: 14 layers
Minimum aperture: 0.4mm
Plate thickness 3.0±0.2mm
Minimum copper thickness: 60μm
Surface Treatment: Immersion Gold
Copper thickness of inner and outer layers: 160μm
Process features: high multi-layer, thick copper, metal edging, inductance control
- PCB Manufacturing Equipment
- Thick Copper PCB Capability
PCB Drilling machine
PCB pattern plating line
PCB solder mask expose machine
PCB pattern expose machine
Strip film etching line
Solder mask screen silk print machine
Solder mask scrubbing line
PCB Flying Probe Test (FPT)
Fully automatic exposure machine
Thick Copper PCB Capability | |
Feature | Capability |
Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
Min. Track/Spacing | For External layers: 4oz Cu 10mil/13mil,5oz Cu 12mil/15mil 6oz Cu 15mil/15mil |
For Internal layers: 4oz Cu 8mil/8mil,5oz Cu 10mil/10mil 6oz Cu 12mil/12mil | |
Min. Hole Size | 0.15 ~ 0.3mm |
Max Outer Layer Copper Weight (Finished) | 13oz |
Max Inner Layer Copper Weight | 12oz |
Board Thickness | 0.6-6mm |
Surface Finishing | HASL lead free,Immersion gold, OSP, Hard Gold,Immersion Silver,Enepig |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
Silkscreen | White, Black |
Via Process | Tenting Vias,Plugged Vias,Vias not covered |
Testing | Fly Probe Testing (Free) and A.O.I. testing |
Build time | 5-15 days |
Lead time | 2-3 days |