Through Hole PCB Assembly

Name: Through Hole PCB Assembly Telecom Equipment PCB

Substrate: FR4

Copper Thickness: 1/3OZ- 6OZ

Plate thickness: 0.21-6.0mm

minute. Hole size: 0.20mm

minute. Line width: 4 million

minute. Line spacing: 0.075 mm

Surface treatment: spray tin/gold drill/OSP/lead-free spray tin

Board size: minimum 10*15mm, maximum 508*889mm

Product Type: OEM&ODM

PCB standard: IPC-A-610 D/IPC-III standard

Certificate: ISO9001/ CE//TUV/ ROHS

Warranty: 1 year

Service: One-stop turnkey service

Electronic testing: 100%

Logistics: Air/Sea

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Product Details Data Sheet

HTB1

Model Number: PCB/PCB Assembly	Place of Origin:Guangdong, China
Supplier Type: OEM/ODM	Layer:1-20
Board Thickness:0.20mm-4.0mm	Copper Thickness:17.5um-175um (0.5oz-5oz)
Solder mask color: red, black, blue, green, yellow	Frequency of stencil cleaning:1 time/5 to 10 pieces
Surface Treatment: HASL, Lead free HASL, OSP, Gold Plating, Immersion gold	Min Trace Width: 0.15mm
Min. Line Spacing:3 mil (0.075 mm)	Min Space Width: 0.15mm
Base Material: FR4/CEM-1/CEM-3/Aluminium	Min Drilling Dia: 0.2mm