Security Equipment Turnkey PCB Assembly
Name: Security Equipment Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Communication motherboard Turnkey PCB Assembly
Name: Communication motherboard Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
In-vehicle communication system PCB Assembly
Name: In-vehicle communication system Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Infrared Spectrometer Turnkey PCB Assembly
Name: Infrared Spectrometer Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
CNC system Turnkey PCB Assembly
Name: CNC system Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Insulation material: organic resin
Projector Turnkey PCB Assembly
Name: Projector Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Insulation material: organic resin
Industrial Control Turnkey PCB Assembly
Name: Industrial Control Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Insulation material: organic resin
Medical Equipment Turnkey PCB Assembly
Name: Medical Equipment Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Insulation material: organic resin
Name: Smart home appliance PCBA
Substrate: FR4
Copper Thickness: 1 oz
Plate thickness: 1.6mm
Minimum hole size: 0.2mm
Minimum line width: 3ml
Minimum line spacing: 3ml
Finish: 3ml
Board size: customized
Product Name: PCB/PCBA Component Prototype
Material: FR4/Aluminum/Ceramic CEM1
Layers: 1-22 layers
Solder mask color: blue green red black white etc
Screen printing color: black white yellow red blue
Test service: 100%
Applications: Medical, Automotive, Aviation, Security, LED, Industrial
Size: up to 900*1200mm
Name: Ventilator PCB Assembly
Substrate: FR4
Copper Thickness: 1 oz
Plate thickness: 1.6mm
Minimum hole size: 0.2mm
Minimum line width: 3ml
Minimum line spacing: 3ml
Finish: 3ml
Board size: customized
Product Name: PCB/PCBA Component Prototype
Material: FR4/Aluminum/Ceramic CEM1
Layers: 1-22 layers
Solder mask color: blue green red black white etc
Screen printing color: black white yellow red blue
Test service: 100%
Applications: Medical, Automotive, Aviation, Security, LED, Industrial
Size: up to 900*1200mm
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Our estimated delivery times start the day after you place your order, depending on the volume and complexity of your turnkey PCB assembly requirements.
We do visual inspections, AOI inspections, X-ray inspections, functional testing and more!
There are several factors including board count, PCB type, SMT pad count, via count, BGA component count, and complexity of PCB assembly.
A complete turnkey PCB assembly service offers multiple benefits including ease of management, low or high volume assembly, multiple services, fast lead times, and more!
Offering turnkey PCB assembly services means that the supplier will handle all tasks including component or part sourcing, manufacturing, assembly and final delivery!